EPM570F256C3N vs EPM570F256C5 Comparison
Detailed side-by-side comparison of EPM570F256C3N by Intel and EPM570F256C5 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM570F256C3N | EPM570F256C5 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $13.75 | $7.10 |
| Family | MAX II | β |
| Logic Elements (LEs) | 570 | β |
| Equivalent Macrocells | 440 | β |
| User Flash Memory (UFM) | 8 Kbits | β |
| Maximum Operating Frequency | 304 MHz | 201.1 MHz |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 Β΅m |
| Core Voltage | 2.5 V / 3.3 V | β |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | β |
| Package | 256-ball FBGA (FineLine BGA) | 256-ball FBGA |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | β |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | β |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | β |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL level not stated in provided data] | β |
| RoHS Status | Compliant (per DigiKey listing) | β |
| Lead-Free | Yes (per suffix 'N' convention) | β |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | β |
| Series | β | MAX II |
| Logic Elements | β | 570 |
| Macro Cells | β | 440 |
| User I/O | β | 160 |
| User Flash Memory | β | 8 Kbit |
| Supply Voltage - Internal | β | 2.5 V / 3.3 V |
| Propagation Delay (tPD max) | β | 5.4 ns |
| Programmable Type | β | In System Programmable (Flash) |
| JTAG Support | β | IEEE 1149.1 |
| Operating Temperature | β | 0 Β°C to +85 Β°C (Commercial) |
| Speed Grade | β | C5 (5 ns) |