EPM570F256C3N vs EPM570F256C5 Vergleich
Detaillierter Direktvergleich von EPM570F256C3N von Intel und EPM570F256C5 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570F256C3N | EPM570F256C5 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,75 | $7,10 |
| Family | MAX II | — |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | 201.1 MHz |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 µm |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Gehäuse | 256-ball FBGA (FineLine BGA) | 256-ball FBGA |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level not stated in provided data] | — |
| RoHS-Status | Compliant (per DigiKey listing) | — |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Series | — | MAX II |
| Logic Elements | — | 570 |
| Macro Cells | — | 440 |
| User I/O | — | 160 |
| User Flash Memory | — | 8 Kbit |
| Supply Voltage - Internal | — | 2.5 V / 3.3 V |
| Propagation Delay (tPD max) | — | 5.4 ns |
| Programmable Type | — | In System Programmable (Flash) |
| JTAG Support | — | IEEE 1149.1 |
| Betriebstemperatur | — | 0 °C to +85 °C (Commercial) |
| Speed Grade | — | C5 (5 ns) |