EPM570F256C3N vs EPM570F256C5 Сравнение
Подробное сравнение бок о бок EPM570F256C3N от Intel и EPM570F256C5 от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EPM570F256C3N | EPM570F256C5 |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $13,75 | $7,10 |
| Family | MAX II | — |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | 201.1 MHz |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 µm |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Корпус | 256-ball FBGA (FineLine BGA) | 256-ball FBGA |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | — |
| Тип монтажа | Surface Mount | Surface Mount |
| Уровень MSL | [DATA_NEEDED: MSL level not stated in provided data] | — |
| Статус RoHS | Compliant (per DigiKey listing) | — |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Series | — | MAX II |
| Logic Elements | — | 570 |
| Macro Cells | — | 440 |
| User I/O | — | 160 |
| User Flash Memory | — | 8 Kbit |
| Supply Voltage - Internal | — | 2.5 V / 3.3 V |
| Propagation Delay (tPD max) | — | 5.4 ns |
| Programmable Type | — | In System Programmable (Flash) |
| JTAG Support | — | IEEE 1149.1 |
| Рабочая температура | — | 0 °C to +85 °C (Commercial) |
| Speed Grade | — | C5 (5 ns) |