H5AN4G8NBJR-UHI vs H5AN4G8NBJR-UHCR Comparison
Detailed side-by-side comparison of H5AN4G8NBJR-UHI by SK hynix and H5AN4G8NBJR-UHCR by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5AN4G8NBJR-UHI | H5AN4G8NBJR-UHCR |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.25 | $3.18 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | 4 Gbit |
| Organization | 512M x 8 | 512M x 8 |
| Speed Grade | DDR4-2400 (PC4-19200) | UH (DDR4-2400 class, PC2400) |
| Supply Voltage (VDD) | 1.2 V | — |
| Package | FBGA-78 (78-ball fine-pitch BGA) | 78-ball FBGA (11 mm x 7.5 mm) |
| Mounting Type | Surface Mount | Surface Mount (BGA solder-down) |
| Grade | Industrial (-UHI suffix) | — |
| Data Rate | 2400 MT/s | — |
| Interface | JEDEC DDR4 SDRAM | DDR4 SSTL12 |
| Bank Architecture | DDR4 bank group architecture | — |
| Refresh | Self-refresh and auto-refresh support | [DATA_NEEDED: refresh rate 1x/2x specification] |
| Termination | On-die termination (ODT) | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | — |
| CAS Latency | [DATA_NEEDED: CAS latency at DDR4-2400] | [DATA_NEEDED: CL value for UH grade] |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Supply Voltage | — | 1.2 V (VDD) |
| Internal Prefetch | — | 8n |
| Operating Case Temperature | — | -40C to +85C (industrial range) |
| Extended Temperature Range | — | Up to +95C case temperature (per datasheet conditions) |
| Lead Free | — | Yes |
| Halogen Free | — | Yes |
| Packaging Suffix | — | -R = Tape and Reel |