H5AN4G8NBJR-UHI - 4Gb DDR4-2400 SDRAM | SK hynix
MPN: H5AN4G8NBJR-UHI ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.2 | $3.20 |
| 10 | $2.95 | $29.50 |
| 100 | $2.7 | $270.00 |
| 500 | $2.45 | $1,225.00 |
| 1,000 | $2.25 | $2,250.00 |
Drop-in alternatives for H5AN4G8NBJR-UHI — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →H5AN4G8NBJR-UHI Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 4 Gbit |
| Organization | 512M x 8 |
| Speed Grade | DDR4-2400 (PC4-19200) |
| Supply Voltage (VDD) | 1.2 V |
| Package | FBGA-78 (78-ball fine-pitch BGA) |
| Mounting Type | Surface Mount |
| Grade | Industrial (-UHI suffix) |
| Data Rate | 2400 MT/s |
| Interface | JEDEC DDR4 SDRAM |
| Bank Architecture | DDR4 bank group architecture |
| Refresh | Self-refresh and auto-refresh support |
| Termination | On-die termination (ODT) |
H5AN4G8NBJR-UHI fbga-78 (78-ball fine-pitch bga) Pin Configuration Guide
Complete pinout information for H5AN4G8NBJR-UHI (fbga-78 (78-ball fine-pitch bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5AN4G8NBJR-UHI.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5AN4G8NBJR-UHI is suitable for 6 applications: Industrial Control Main Memory, Networking Equipment Buffer Memory, Embedded Compute Modules (COM Express / SMARC), Test and Measurement Instrumentation, Surveillance and Vision Systems, Automotive-Adjacent and Rugged Embedded Systems.
Industrial Control Main Memory
The H5AN4G8NBJR-UHI is purpose-built for industrial-control main memory because the -UHI industrial temperature grade withstands the wide ambient conditions found in factory automation cabinets, motor-control enclosures, and PLC platforms. Its 4Gb 512M x 8 organization provides ample buffer space for real-time control data at DDR4-2400 bandwidth (PC4-19200 class), while the 1.2 V rail keeps memory-subsystem power low enough for passively cooled industrial systems. Deployed as discrete DRAM on a CPU or SoC board with fly-by address routing and on-die termination, it delivers deterministic bandwidth for motion profiles and logging workloads. Self-refresh mode preserves state through low-power standby, and the FBGA-78 footprint enables second-sourcing with Micron or Samsung equivalents without PCB rework.
Recommended
Networking Equipment Buffer Memory
Line cards, switches, and routers rely on large, fast DRAM pools for packet buffering, queue management, and table lookups, and the H5AN4G8NBJR-UHI fits this role with DDR4-2400 data-rate operation and a 4Gb density in a single x8 die. The x8 organization allows granular ECC strategies at the controller level, important for long-duty-cycle networking hardware where uncorrected bit errors degrade uptime. The 1.2 V supply and DDR4 power-down modes reduce per-port power, a critical metric in high-port-count equipment. Because the FBGA-78 package is the industry-standard DDR4 footprint, network OEMs can dual-source with SK hynix suffix variants or Micron MT40A512M8RH-083E to mitigate allocation risk, an increasingly common practice in telecom supply chains.
Recommended
Embedded Compute Modules (COM Express / SMARC)
Computer-on-module carriers for COM Express and SMARC standards frequently specify discrete DDR4 components soldered directly on the module, and the H5AN4G8NBJR-UHI provides 4Gb of DDR4-2400 bandwidth per chip with the industrial reliability the -UHI grade implies. Four x8 devices aggregate into a 64-bit bus with 8 GB of memory, matching typical embedded CPU memory controllers, while 1.2 V operation keeps module thermal design feasible in fanless enclosures. The FBGA-78 land pattern is shared across SK hynix, Micron, and Samsung x8 DDR4 parts, letting module vendors qualify multiple sources on one PCB. Self-refresh supports memory retention across S3/suspend states, and DDR4 ODT simplifies signal integrity on high-layer-count module stackups.
Recommended
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators require deep capture memory with sustained bandwidth, and the H5AN4G8NBJR-UHI supplies 4Gb per device at DDR4-2400, enabling multi-gigabyte acquisition buffers in benchtop instruments. The x8 organization supports straightforward 72-bit ECC memory controllers (64 data plus 8 check devices), preserving measurement integrity during long captures. The industrial -UHI grade tolerates instrument-internal temperature rise above ambient, which is common in densely packed acquisition hardware. Its 1.2 V supply eases power-supply design in instruments already constrained by analog rail noise concerns, and the standard FBGA-78 footprint allows vendors to swap in Samsung K4A8G085WC-BCWE or Micron equivalents during component shortages without redesign.
Recommended
Surveillance and Vision Systems
Network video recorders and smart-camera platforms stream multiple high-resolution video channels through DRAM before write-out to storage, making 4Gb DDR4 components like the H5AN4G8NBJR-UHI a natural fit. The DDR4-2400 data rate sustains the multi-stream aggregate bandwidth of 4K camera pipelines, while 512M x 8 organization supports ECC-protected buffering that prevents visual artifacts from sporadic bit errors in always-on recording systems. The industrial -UHI grade suits outdoor NVR enclosures subject to wide temperature swings, and the 1.2 V rail helps keep passively cooled surveillance hardware within its thermal budget. Using the standard FBGA-78 footprint, security OEMs can alternate between SK hynix, Micron MT40A512M8RH-083E, and Samsung parts to stabilize supply across project volumes.
Recommended
Automotive-Adjacent and Rugged Embedded Systems
Rugged embedded controllers used in telematics gateways, off-highway equipment, and transport infrastructure require memory that survives vibration, thermal cycling, and wide ambient ranges; the FBGA-78 solder-ball mounting of the H5AN4G8NBJR-UHI plus its industrial -UHI grade address these mechanical and thermal demands. The 4Gb density supports map caching, protocol stacks, and data logging at DDR4-2400 bandwidth, while bank-group architecture keeps effective throughput high under the mixed read/write patterns typical of gateway workloads. At 1.2 V, the DRAM contributes minimally to the power budget of battery-backed and ignition-switched systems. The shared DDR4 footprint enables dual-sourcing with Micron and Samsung x8 parts, protecting long-lifecycle rugged programs from single-vendor allocation.
Recommended
Recommended Products Summary
Engineering reference data for H5AN4G8NBJR-UHI — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5AN4G8NBJR-UHC | H5AN4G8NBJR-RDC | MT40A512M8RH-083E | K4A8G085WC-BCWE |
|---|---|---|---|---|---|
| Package | FBGA-78 | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same |
| Brand | SK hynix | SK hynix | SK hynix | Micron Technology | Samsung |
| Density | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Organization | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | DDR4-2400 | [DATA_NEEDED] | [DATA_NEEDED] | DDR4-2666 | [DATA_NEEDED] |
| Temperature Grade | Industrial (-UHI) | Commercial (-UHC) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Sourcing Model | RFQ / distributor quote | RFQ / broker stock | RFQ | Franchise distributor | Franchise distributor |
Key Differentiators
- Industrial temperature grade (vs H5AN4G8NBJR-UHC)
- Standard footprint with broad cross-brand second sourcing (vs MT40A512M8RH-083E)
- Speed-bin flexibility within the same die (vs H5AN4G8NBJR-PBC)
Design Notes
DDR4-2400 routing requires length matching within the controller specification, typically tight matching of DQ/DM/DQS per byte lane and looser but bounded skew on address/command for the fly-by topology. Use on-die termination (ODT) settings from the SK hynix datasheet and write-leveling to close timing at 2400 MT/s. Keep data groups on inner layers with solid reference planes, and avoid splitting the DQ reference plane under escape routing. Validate with eye-diagram tests on the DQS strobe before production sign-off.
Provide three rails: 1.2 V VDD, approximately 2.5 V VPP, and VTT at VDD/2 with a termination regulator capable of sinking and sourcing current. Estimated: a single x8 DDR4 device draws on the order of hundreds of milliwatts at DDR4-2400, so a 4-device 32-bit bus plus VTT needs a multi-amp rail design; size the VTT LDO or switcher with a bulk capacitance of at least 100 uF plus local 0.1 uF ceramics per ball-cluster. Follow the controller vendor power tree, e.g., TI or Renesas DDR power reference designs.
Do not assume speed-grade interchange without controller validation: swapping the -UHI (DDR4-2400) for a slower -PBC suffix can fail boot at programmed CAS latency, while faster bins like Micron MT40A512M8RH-083E (DDR4-2666) generally down-clock safely but must still pass memory training. Also, -UHC commercial-grade parts must not replace -UHI in industrial thermal environments even though they are die-identical. Always re-run memory training and margining after any suffix or brand substitution.
FBGA-78 escape routing uses via-in-pad or dog-bone fan-out; prefer 0.8 mm pitch-compatible via-in-pad with filled vias for signal integrity at 2400 MT/s. Reserve the layer stack for a minimum of one dedicated ground reference under each data group. Add thermal relief consistent with JEDEC-style solder-ball reflow profiles for BGA packages, and define the footprint land pattern per the manufacturer package drawing rather than copying from another vendor to avoid ball-map mismatch on second sources.
Compliance Information
Compliance status not stated in sourced web data. Obtain the official SK hynix environmental report for the H5AN4G8NBJR family for RoHS/REACH/halogen-free confirmation.
