H5AN8G6NDJR-XNC vs H5AN8G8NDJR Comparison

Detailed side-by-side comparison of H5AN8G6NDJR-XNC by SK hynix and H5AN8G8NDJR by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5AN8G6NDJR-XNC H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC ✓ Active
SK hynix
H5AN8G8NDJR H5AN8G8NDJR - 8Gb DDR4 SDRAM 3200MT/s | SK hynix

H5AN8G8NDJR - 8Gb DDR4 SDRAM 3200MT/s | SK hynix

H5AN8G8NDJR ✓ Active

Specification Comparison

Parameter H5AN8G6NDJR-XNC H5AN8G8NDJR
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $55.68 $24.50
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gb —
Memory Organization 512M x16 —
Data Rate 3200 Mbps 3200 MT/s
Supply Voltage (VDD) 1.2 V (max 1.26 V) 1.2 V (1.14V to 1.26V)
Package FBGA-96 (13x7.5 mm) FBGA-78 (7.5x11 mm)
Number of Terminals 96 —
Maximum Operating Temperature 85 °C —
Input/Output Type COMMON —
RoHS Compliant Compliant
Lead-Free Yes Yes
Halogen Free Yes —
Auto Self-Refresh Yes —
Auto Precharge Yes —
Data Mask Yes —
Dynamic On-Chip Termination Yes —
ZQ Calibration Yes —
CRC Function Yes —
Write Leveling Yes —
Asynchronous Reset Yes —
Density — 8 Gb
Organization — 1G x 8
VDDQ — 1.2 V
VPP — 2.5 V
Operating Temperature — 0°C to +95°C (Tc)
CAS Latency — 22 (typical)
tRCD — 22 ns
tRP — 22 ns
Burst Length — 8 and 4 (with burst chop)
Self-Refresh Current — 30 mA (typical)
Active Standby Current — 60 mA (typical)

Datasheets & Resources

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