H5AN8G8NCJR-XNC vs H5AN8G8NCJR-RDC Comparison
Detailed side-by-side comparison of H5AN8G8NCJR-XNC by SK hynix and H5AN8G8NCJR-RDC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5AN8G8NCJR-XNC | H5AN8G8NCJR-RDC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $30.69 | $2.70 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Memory Size | 8 Gbit | — |
| Organization | 1 Gb x 8 | x8 |
| Data Rate | 3200 Mbps (DDR4-3200) | up to 2666 Mbps |
| Clock Frequency | 1.6 GHz | — |
| Supply Voltage | 1.14 V to 1.26 V (1.2 V nominal) | 1.2 V (VDD) |
| Package | 78-ball FBGA, 7.5 mm x 11 mm | 78-ball FBGA |
| Operating Temperature | 0 C to +85 C | [DATA_NEEDED: operating temperature range for -RDC suffix] |
| Mounting Type | Surface Mount | Surface Mount |
| Interface | DDR4 (8-bit data interface) | DDR4 (JEDEC standard) |
| Architecture | Bank-group based DDR4 | — |
| Refresh | Auto self-refresh | — |
| Precharge | Auto precharge | — |
| On-Chip Termination | Dynamic ODT | — |
| Calibration | ZQ calibration, write leveling | — |
| Error Handling | CRC function | — |
| Reset | Asynchronous reset | — |
| Data Mask | Data mask function | — |
| Current - Operating | 39 mA | — |
| Current - Standby | 30 mA | — |
| RoHS Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes | — |
| Density | — | 8 Gb (1 GB) |
| Bank Architecture | — | 4 bank groups x 4 banks |
| Burst Length | — | BL8 |
| CAS Latency | — | [DATA_NEEDED: CAS latency for -RDC speed grade] |
| Generation | — | C-die family (NCJR) |
| Lead Free | — | Yes |
| Halogen Free | — | Yes |