H5AN8G8NCJR-RDC - 8Gb DDR4 SDRAM x8 2666Mbps | SK Hynix
MPN: H5AN8G8NCJR-RDC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.55 | $35.50 |
| 100 | $3.2 | $320.00 |
| 500 | $2.95 | $1,475.00 |
| 1,000 | $2.7 | $2,700.00 |
Drop-in alternatives for H5AN8G8NCJR-RDC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →H5AN8G8NCJR-RDC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 8 Gb (1 GB) |
| Organization | x8 |
| Data Rate | up to 2666 Mbps |
| Supply Voltage | 1.2 V (VDD) |
| Interface | DDR4 (JEDEC standard) |
| Bank Architecture | 4 bank groups x 4 banks |
| Burst Length | BL8 |
| Package | 78-ball FBGA |
| Mounting Type | Surface Mount |
| Generation | C-die family (NCJR) |
| Lead Free | Yes |
| Halogen Free | Yes |
| RoHS Status | Compliant |
H5AN8G8NCJR-RDC 78-ball fbga Pin Configuration Guide
Complete pinout information for H5AN8G8NCJR-RDC (78-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5AN8G8NCJR-RDC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5AN8G8NCJR-RDC is suitable for 6 applications: Server Main Memory (RDIMM / Memory-Down), Workstation and High-End Desktop Memory, Networking and Telecom Equipment, Industrial Computing and Embedded Systems, Test and Measurement Instrumentation, Automotive and Transportation Infotainment.
Server Main Memory (RDIMM / Memory-Down)
The H5AN8G8NCJR-RDC fits server main-memory designs where the x8 organization enables x8-based SDDC (single-device data correction) under ECC, a chipkill-class reliability feature required in enterprise platforms. Its 2666 Mbps data rate and 1.2V operation deliver high bandwidth with reduced power versus DDR3, and the 78-ball FBGA package is the industry-standard component form for RDIMM/LRDIMM assembly and memory-down server boards. Placed on a fly-by-terminated DDR4 channel with registered clocking, the device sustains full-rate operation at 1333 MHz CK, giving roughly 21 GB/s per device peak bandwidth. Validation should include controller training at the -R timing table to guarantee margin across the commercial temperature range.
Recommended
Workstation and High-End Desktop Memory
Workstation platforms benefit from the 8Gb density per device of the H5AN8G8NCJR-RDC, allowing multi-GB DIMM configurations with fewer chips per module. The 2666 Mbps grade matches mainstream desktop and workstation memory clocks, and the 1.2V rail reduces module thermal load compared with DDR3-class parts, simplifying heatsink decisions on buffered and unbuffered modules. In an ECC UDIMM design, the x8 organization supports single-bit error correction per device, improving uptime for CAD, simulation, and content-creation workloads. The device's BL8 burst and 4-bank-group architecture sustain sequential bandwidth for large dataset handling. Layout must respect DDR4 length matching and VTT termination to achieve eye margin at full data rate.
Recommended
Networking and Telecom Equipment
Routers, switches, and telecom line cards use DDR4 as packet-buffer and control-plane memory. The H5AN8G8NCJR-RDC provides 8Gb density and 2666 Mbps bandwidth in a compact 78-ball FBGA, fitting memory-down layouts on dense line cards where module height is restricted. Its bank-group architecture sustains the mixed read/write patterns typical of packet buffering, while 1.2V operation lowers system power in always-on network equipment. The x8 bus width simplifies controller interfacing for network SoCs that expose 16/32/64-bit DDR4 channels. Designers should size trace lengths for multi-rank or multi-device fly-by topologies and retrain timing at production test to hold eye margin across the commercial temperature range.
Recommended
Industrial Computing and Embedded Systems
Industrial PCs, machine-vision controllers, and edge-compute gateways need high-bandwidth volatile memory; the H5AN8G8NCJR-RDC supplies 8Gb density and 2666 Mbps throughput in a surface-mount FBGA that survives vibration better than socketed DIMMs. The 1.2V core keeps thermal budgets manageable in fanless enclosures, and its commercial temperature range suits controlled factory-floor environments (industrial-rated variants should be selected for extended range). The x8 organization integrates cleanly with industrial SoCs offering 32/64-bit DDR4 buses, and JEDEC-standard command timing enables multi-vendor second sourcing. Designers should implement proper power-rail sequencing and use controller training at boot to maintain data integrity despite temperature drift.
Recommended
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators rely on deep capture memory, and the H5AN8G8NCJR-RDC's 8Gb density supports long record lengths per instrument channel bank. Its 2666 Mbps rate provides sustained write bandwidth for real-time streaming acquisition architectures, while the 1.2V supply reduces internal heating in thermally sensitive measurement front ends. The 78-ball FBGA allows compact memory-down arrays around the acquisition FPGA, and the x8 bus enables flexible 16/32/64-bit channel scaling. Instruments typically run DDR4 at reduced clocks for timing margin; the -R grade still delivers full bandwidth headroom at standard 1333 MHz operation with conventional controller training and termination settings.
Recommended
Automotive and Transportation Infotainment
Automotive IVI head units, digital clusters, and ADAS domain controllers demand high-bandwidth DRAM; the H5AN8G8NCJR-RDC's 8Gb density and 2666 Mbps rate support multi-camera sensor buffering and rich graphics stacks. Note that this -C (commercial temperature) grade is intended for platforms with cabin-grade thermal control; automotive-qualified memory variants should be selected for under-hood or extreme-temperature zones. The 78-ball FBGA supports memory-down placement on compact compute modules, and the x8 organization fits typical SoC 32-bit DDR4 buses. Designers must implement rail sequencing, signal-integrity simulation for the flex/cable interconnects common in vehicle deployments, and verify thermal derating of the data rate in hot in-cabin conditions.
Recommended
Recommended Products Summary
Engineering reference data for H5AN8G8NCJR-RDC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5AN8G8NCJR-PBC | H5AN8G8NCJR-XNC | H5AN8G8NCJR-VKC | K4A8G085WC-BCRC | MT40A1G8AG-062E |
|---|---|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same | 78-ball FBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Samsung Electronics | Micron Technology |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | x8 | x8 | x8 | x8 | x8 | x8 |
| Data Rate | up to 2666 Mbps | up to 2133 Mbps class | up to 3200 Mbps | 2666 Mbps class | 2666 Mbps class | 2666 Mbps class |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM |
| Lead Free / Halogen Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Balanced 2666 Mbps bandwidth at mainstream cost (vs H5AN8G8NCJR-XNC)
- JEDEC-standard cross-brand second sourcing (vs K4A8G085WC-BCRC)
- x8 organization enables server-class ECC (SDDC) (vs H5AN8G6NAFR-VKC)
Design Notes
DDR4 fly-by routing is mandatory for multi-device topologies: route address/command to each 78-ball FBGA device in daisy-chain with on-die termination (ODT) absorbing reflections, while DQ/DQS pairs are point-to-point and must be length-matched within controller-recommended skew (typically a few mils per inch of trace, per JEDEC DDR4 design guidance). Maintain a solid reference plane under all DDR4 nets and keep VTT distribution as a low-inductance plane with decoupling near each termination load. Follow the SK Hynix DDR4 design guide and your controller vendor's layout checklist for exact constraints.
The device operates from 1.2V VDD plus VDDQ; use wide planes or pours rather than traces to keep rail impedance low during simultaneous switching of x8 DQ loads. Provide VPP (2.5V) per DDR4 requirements. Estimated: at full 2666 Mbps operation with 8 DQ pins active, per-device dynamic current is on the order of hundreds of milliamps; budget bulk and 100 nF ceramic decoupling per device and verify with rail transient simulation. Always sequence VDD/VDDQ before or together with VPP per controller vendor guidance.
Speed-grade suffixes are not interchangeable assumptions: the -RDC (2666 Mbps), -VKC, -PBC, and -XNC grades carry different AC timing tables. Substituting a slower grade into a design validated at 3200 Mbps will fail margin tests, and omitting controller retraining after a second-source swap (e.g., Samsung K4A8G085WC or Micron MT40A1G8AG) can cause boot failures even when the footprint is identical. Re-run memory training and margin validation (read/write eye, Vref offset sweep) for every die/speed combination in production.
Compliance Information
Datasheet aggregator listing for H5AN8G8NCJR-XXC states Lead-Free & Halogen-Free construction. REACH and conflict-minerals status not stated in provided data.
