H5ANAG6NAMR-UHC vs H5ANAG6NCR-RDC Comparison

Detailed side-by-side comparison of H5ANAG6NAMR-UHC by SK hynix and H5ANAG6NCR-RDC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter H5ANAG6NAMR-UHC H5ANAG6NCR-RDC
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $4.50 $72.10
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Density 16 Gbit (2 GB) —
Organization 1G x 16 1G x 16
Speed Grade / Data Rate DDR4-2400 (UHC bin, PC4-19200) —
Supply Voltage (VDD) 1.2 V 1.2 V
Architecture CMOS DDR4 with bank groups —
Power Class Normal Power —
Package FBGA-96 (PBGA96) 96-ball FBGA
Mounting Type Surface Mount (BGA solder ball) Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature range] [DATA_NEEDED: Operating Temperature Range]
Refresh Self-refresh and auto-refresh (DDR4 standard 64 ms) —
CAS Latency [DATA_NEEDED: CL for UHC bin] —
Interface Type Parallel, synchronous, double data rate —
Available Speed Bins (family) PB / RD / TF / UH / VK —
Application Class Main memory, embedded, industrial —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS Status]
Lifecycle Status Active production —
Memory Size — 16 Gb (2 GB)
Data Rate — 3200 Mbps (PC4-25600 class)
Package Body — Rectangular, 8 mm width
Maximum Standby Current — 0.074 A
Number of Terminals (Balls) — 96
Auto Self-Refresh — Yes
Auto Precharge — Yes
Asynchronous Reset — Yes
Data Mask (DM) Function — Yes
Dynamic On-Chip Termination (ODT) — Yes
ZQ Calibration — Yes
CRC Function — Yes
Write Leveling — Yes
Refresh Interval — [DATA_NEEDED: Refresh Interval]

Datasheets & Resources

Browse All Products Create BOM Request Quote