H5ANAG6NCR-RDC - 16Gb DDR4 SDRAM 3200Mbps x16 | SK Hynix
MPN: H5ANAG6NCR-RDC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.23 | $85.23 |
| 10 | $82 | $820.00 |
| 100 | $78.5 | $7,850.00 |
| 500 | $75.2 | $37,600.00 |
| 1,000 | $72.1 | $72,100.00 |
Drop-in alternatives for H5ANAG6NCR-RDC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5ANAG6NCR-PBC
✅ Drop-In✓ In Stock
$70.2 / Unit
View Datasheet →H5ANAG6NBJR-RDC
✅ Drop-In✓ In Stock
$9.6 / Unit
View Datasheet →H5ANAG6NAMR-UHC
✅ Drop-In✓ In Stock
$4.5 / Unit
View Datasheet →H5ANAG6NCJR-XNC
✅ Drop-In✓ In Stock
$84.97 / Unit
View Datasheet →H5ANAG8NCR-RDC
✅ Drop-In✓ In Stock
$1 / Unit
View Datasheet →H5ANAG8NCJR-XNC
✅ Drop-In✓ In Stock
$39.3 / Unit
View Datasheet →H5ANAG6NCR-RDC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Size | 16 Gb (2 GB) |
| Organization | 1G x 16 |
| Data Rate | 3200 Mbps (PC4-25600 class) |
| Supply Voltage (VDD) | 1.2 V |
| Package | 96-ball FBGA |
| Package Body | Rectangular, 8 mm width |
| Maximum Standby Current | 0.074 A |
| Mounting Type | Surface Mount |
| Number of Terminals (Balls) | 96 |
| Auto Self-Refresh | Yes |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| Data Mask (DM) Function | Yes |
| Dynamic On-Chip Termination (ODT) | Yes |
| ZQ Calibration | Yes |
| CRC Function | Yes |
| Write Leveling | Yes |
H5ANAG6NCR-RDC rectangular, 8 mm width Pin Configuration Guide
Complete pinout information for H5ANAG6NCR-RDC (rectangular, 8 mm width package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5ANAG6NCR-RDC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5ANAG6NCR-RDC is suitable for 6 applications: Networking and Telecom Equipment, Embedded Computing and Industrial Controllers, Server and Storage Modules, Test and Measurement Instruments, Medical Imaging and Diagnostic Systems, Video Surveillance and Broadcast.
Networking and Telecom Equipment
The H5ANAG6NCR-RDC fits switch, router, and line-card designs whose SoCs expose 16-bit DDR4 channels at up to 3200 Mbps. The x16 organization reaches line-card buffer depths with only two devices on a 32-bit bus, reducing BGA count versus x8 alternatives, while CRC and CA parity protect data integrity in continuously running infrastructure. The 96-ball FBGA at 8 mm body width supports the dense routing typical of high-port-count systems. Placed with point-to-point fly-by or star topology and per-byte ODT enabled, the interface sustains full 3200 Mbps timing margins; DDR4's asynchronous RESET guarantees a defined state across system reboots, important for carrier-grade uptime requirements.
Recommended
Embedded Computing and Industrial Controllers
Industrial automation controllers and embedded computers use the H5ANAG6NCR-RDC for main memory where its 1.2V supply lowers system power and heat versus DDR3 designs. The 16Gb density per device enables 4 GB+ memory on industrial motherboards with a few components, and auto self-refresh preserves memory contents in suspend-to-RAM low-power states common in factory HMI panels. With 0.074 A maximum standby current, battery-backed or always-on auxiliary systems see minimal drain. The ZQ calibration feature maintains termination accuracy across industrial temperature swings, sustaining 3200 Mbps signaling reliability on cost-effective 4-6 layer PCBs without exotic materials.
Recommended
Server and Storage Modules
For storage controllers, memory buffers, and BMC subsystems, the H5ANAG6NCR-RDC supplies 2 GB per device at DDR4-3200 bandwidth. The 16-bit organization complements 64/72-bit UDIMM and RDIMM topologies, and the same-package x8 SK Hynix siblings allow ECC-enabled designs by mixing rank width with the x72 ECC byte. CRC and write leveling support reliable operation on long-module routing with multiple ranks, while dynamic ODT optimizes termination per rank during reads and writes. The FBGA-96 footprint reuses standard DDR4 module land patterns, so module designers can drop this part into existing certified layouts and re-qualify timing only at the new grade.
Recommended
Test and Measurement Instruments
Oscilloscopes, signal generators, and protocol analyzers require deep capture memory fed by wide, fast DRAM banks. The H5ANAG6NCR-RDC provides 16Gb per device at 3200 Mbps, letting instrument designers build multi-GB capture buffers with four to eight devices on 32- or 64-bit buses. Write leveling and ZQ calibration sustain signal integrity across the long, matched-length routing typical of instrument main boards, and the asynchronous RESET input lets the FPGA/ASIC memory controller reinitialize the DRAM subsystem deterministically after configuration. The 1.2V rail simplifies power sequencing relative to multi-voltage legacy DRAM designs in precision instruments.
Recommended
Medical Imaging and Diagnostic Systems
Ultrasound and digital radiography platforms buffer large image streams at sustained rates; the H5ANAG6NCR-RDC's 3200 Mbps x16 interface delivers the write bandwidth needed for multi-megapixel frame capture, while 16Gb density supports multi-second cineloop storage per device pair. Features such as CRC and CA parity reduce silent data corruption risk in diagnostic paths, and the 96-ball FBGA's low profile fits the compact heads and console electronics of modern medical hardware. Auto self-refresh supports instant-on standby behavior required in clinics, and the low 1.2V operation contributes to meeting enclosure thermal budgets without forced airflow in patient-proximate equipment.
Recommended
Video Surveillance and Broadcast
NVR appliances and broadcast video servers use the H5ANAG6NCR-RDC as stream-buffer memory between camera/frame inputs and storage arrays. A pair of these x16 devices provides a 32-bit DDR4-3200 channel delivering 25.6 GB/s theoretical bandwidth, sufficient to absorb multi-channel 4K ingest bursts before disk writes complete. The 16Gb-per-device density minimizes component count in space-limited recorder chassis, and dynamic ODT maintains margins on the multi-drop fly-by topologies used in these systems. Because the part is footprint-compatible with other H5ANAG6N grade suffixes, appliance makers can qualify one PCB across multiple supply sources and speed bins.
Recommended
Recommended Products Summary
Engineering reference data for H5ANAG6NCR-RDC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5ANAG6NCR-PBC | H5ANAG6NBJR-RDC | H5ANAG6NAMR-UHC | H5ANAG8NCR-RDC | H5ANAG6NCJR-XNC |
|---|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Memory Size | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | x16 | x16 | x16 | x16 | x8 | x16 |
| Data Rate | 3200 Mbps (R grade) | P grade class | 3200 Mbps (R grade) | UH grade (faster bin) | 3200 Mbps (R grade) | XN grade class |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Maximum Standby Current | 0.074 A | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Documented Stock | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 41,700 pcs (Octopart, Aug 31, 2026) |
| Feature Set (CRC, DM, ODT, ZQ, Write Leveling) | All supported | All supported | All supported | All supported | All supported | All supported |
Key Differentiators
- 3200 Mbps R-grade timing at 1.2V (vs H5ANAG6NCR-PBC)
- x16 organization halves device count (vs H5ANAG8NCR-RDC)
- Supply availability advantage (vs H5ANAG6NCJR-XNC)
Design Notes
Route the x16 DQ/DM/UDQS/LDQS groups as matched-length byte pairs with intra-group skew held within ±25 mils and refer them to a continuous ground plane. Enable write leveling during controller calibration to deskew DQS at the DRAM, and keep the 240-ohm 1% ZQ calibration resistor within 10 mm of the ZQ ball with a short low-inductance ground return. At 3200 Mbps, stubs longer than 5 mm on strobe nets cause reflections that show up as first-transition errors during margin testing.
Provide a dedicated 1.2V rail with bulk capacitance (2x 100 uF) plus one 0.1 uF ceramic per few balls distributed across the FBGA field to handle simultaneous switching currents during burst writes. Estimated: at 3200 Mbps with roughly 10 pF per net switching, transient currents are multi-ampere; budget the VRM for worst-case IDD read/write currents per the SK Hynix datasheet IDD tables rather than the 0.074 A standby figure. Sequence VDD and VDDQ together and hold RESET low until rails stabilize.
Do not mix x16 and x8 SK Hynix siblings on the same data bus without confirming controller support: H5ANAG8NCR-RDC changes the DQ/DM/DQS ball mapping versus this x16 part even though the 96-ball FBGA footprint is shared. Also confirm the speed-grade suffix (RDC vs PBC vs UHC) is accepted by your memory controller's calibration tables - substituting grades without re-validating is the most common cause of post-substitution boot failures in the field.
Compliance Information
Compliance statements were not present in the provided web data. SK Hynix standard DDR4 products are generally lead-free/RoHS-compliant, but this must be confirmed against the official product page before claiming compliance. No AEC-Q100 automotive qualification is indicated for the standard -RDC bin.
