H5ANAG6NCJR-XNC vs H5ANAG6NBJR-UHC Comparison
Detailed side-by-side comparison of H5ANAG6NCJR-XNC by SK hynix and H5ANAG6NBJR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5ANAG6NCJR-XNC | H5ANAG6NBJR-UHC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | Memory ICs | DRAM |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $84.97 | $8.09 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Memory Size | 16 Gbit | — |
| Memory Organization | 1G x 16 | — |
| Data Rate | 3200 Mbps/pin | — |
| Supply Voltage Range | 1.14 V to 1.26 V (VDD/VDDQ) | — |
| Interface | Parallel | DDR4 (CMOS) |
| Package | FBGA-96 | PBGA96 / FBGA-96 (TFBGA) |
| Mounting Type | Surface Mount | — |
| Auto Self-Refresh | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | Supported |
| Data Mask Function | Yes | — |
| Dynamic On-Chip Termination (ODT) | Yes | — |
| ZQ Calibration | Yes | Supported |
| CRC Function | Yes | — |
| Write Leveling | Yes | Supported |
| Packaging | Tray | — |
| RoHS Status | Compliant | RoHS Compliant |
| Density | — | 4 Gb |
| Organization | — | 256M x 16 |
| Package Dimensions | — | 13 mm length (per JESD-30 R-PBGA-B96) |
| Access Mode | — | Multi Bank, Page Burst |
| Operating Temperature | — | -40C to +95C |
| Refresh | — | Auto / Self Refresh |
| Data Mask | — | Supported (DM function) |
| On-Chip Termination | — | Dynamic ODT |
| CRC | — | Supported |
| Supply Voltage Class | — | DDR4 (1.2 V class) |
| REACH Compliance | — | Compliant |
| ECCN | — | EAR99 |
| HTS Code | — | 8542.32.00.36 |
| CAS Latency | — | [DATA_NEEDED: CAS Latency] |
| Max Data Rate | — | [DATA_NEEDED: Max Data Rate] |