H5ANAG6NCMR-XNI vs H5ANAG6NAMR-UHC Comparison

Detailed side-by-side comparison of H5ANAG6NCMR-XNI by SK hynix and H5ANAG6NAMR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5ANAG6NCMR-XNI H5ANAG6NCMR-XNI - DDR4 16Gb 3200Mbps DRAM | SK Hynix

H5ANAG6NCMR-XNI - DDR4 16Gb 3200Mbps DRAM | SK Hynix

H5ANAG6NCMR-XNI ✓ Active

Specification Comparison

Parameter H5ANAG6NCMR-XNI H5ANAG6NAMR-UHC
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $4.95 $4.50
Memory Type DDR4 SDRAM (volatile DRAM) DDR4 SDRAM
Memory Size 16 Gb —
Memory Organization 1G x 16 —
Data Rate 3200 Mbps (DDR4-3200, XN speed bin) —
Supply Voltage 1.2 V —
Technology CMOS Double Data Rate IV Synchronous DRAM —
Power Class Normal Power Normal Power
Package FBGA-96 FBGA-96 (PBGA96)
Mounting Type Surface Mount Surface Mount (BGA solder ball)
Interface Parallel (DDR4) —
Product Status Active —
Application Domain Main memory, industrial controllers, computing modules, consumer electronics —
Memory Format DRAM —
Speed Bin Family UH/VK/WM/XN —
Operating Temperature [DATA_NEEDED: Operating Temperature] [DATA_NEEDED: operating temperature range]
VPP Supply Voltage [DATA_NEEDED: VPP Supply Voltage] —
MSL Level [DATA_NEEDED: MSL Level] —
Memory Density — 16 Gbit (2 GB)
Organization — 1G x 16
Speed Grade / Data Rate — DDR4-2400 (UHC bin, PC4-19200)
Supply Voltage (VDD) — 1.2 V
Architecture — CMOS DDR4 with bank groups
Refresh — Self-refresh and auto-refresh (DDR4 standard 64 ms)
CAS Latency — [DATA_NEEDED: CL for UHC bin]
Interface Type — Parallel, synchronous, double data rate
Available Speed Bins (family) — PB / RD / TF / UH / VK
Application Class — Main memory, embedded, industrial
RoHS Status — [DATA_NEEDED: RoHS status]
Lifecycle Status — Active production

Datasheets & Resources

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