H5ANAG8NCJR-XNC vs H5ANAG6NCJR-XN Comparison

Detailed side-by-side comparison of H5ANAG8NCJR-XNC by SK hynix and H5ANAG6NCJR-XN by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

SK hynix
H5ANAG8NCJR-XNC H5ANAG8NCJR-XNC - 16Gb DDR4-3200 SDRAM 2Gx8 | SK Hynix

H5ANAG8NCJR-XNC - 16Gb DDR4-3200 SDRAM 2Gx8 | SK Hynix

H5ANAG8NCJR-XNC ✓ Active

Specification Comparison

Parameter H5ANAG8NCJR-XNC H5ANAG6NCJR-XN
Brand SK hynix SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $65.63 $71.20
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 16 Gbit 16 Gbit (1G x 16)
Organization 2G x 8 1G x 16
Data Rate 3200 MT/s (DDR4-3200) 3200 Mbps/pin (DDR4-3200)
Supply Voltage (VDD) 1.2 V 1.14 V to 1.26 V
Package FBGA-78 (7.5 x 11 mm) FBGA-96 (96-ball)
Operating Temperature 0C to +95C [DATA_NEEDED: operating temperature range]
Mounting Type Surface Mount Surface Mount (BGA)
Process Node 1z nm (non-EUV) —
Die Bit Density 0.296 Gb/mm2 —
Peak Bandwidth (per 64-bit channel) 25.6 GB/s at DDR4-3200 —
CAS Latency (CL) [DATA_NEEDED: CAS Latency] —
Refresh [DATA_NEEDED: refresh specification] —
RoHS Status Compliant Compliant
Base Part Number Family H5ANAG8NCJR (16Gb DDR4 CMOS SDRAM) —
Speed Grade Suffix -XNC (0~95C commercial) —
Package Width — 8 mm
Auto Self-Refresh — Yes
Auto Precharge — Yes
Asynchronous Reset — Yes
Data Mask (DM) — Yes
Dynamic On-Chip Termination (ODT) — Yes
ZQ Calibration — Yes
CRC (Command/Address) — Yes
Write Leveling — Yes
Maximum Standby Current — 0.074 A (per Vyrian listing)
CAS Latency — [DATA_NEEDED: CAS latency for -XN speed grade]

Datasheets & Resources

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