IRSM808-105MH vs IRSM808-105MHTR Comparison
Detailed side-by-side comparison of IRSM808-105MH by Infineon and IRSM808-105MHTR by Infineon. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | IRSM808-105MH | IRSM808-105MHTR |
|---|---|---|
| Brand | Infineon | Infineon |
| Category | Motor Drivers | Motor Drivers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.65 | $2.31 |
| Topology | Half-bridge (2 FREDFET switches + HVIC driver) | Half-Bridge (High-Side + Low-Side) |
| Drain-Source Blocking Voltage (VDS) | 500 V | 500 V |
| Continuous Drain Current (ID @ TC=25C) | 10 A | β |
| Static Drain-Source On-Resistance (RDS(on)) | 0.8 ohm max | β |
| Maximum Switching Power | 200 W | β |
| Gate Driver | Integrated HVIC (half-bridge, bootstrap) | Integrated high-voltage level-shift HVIC |
| Dead-Time Generation | Internal (configurable via DT pin) | Integrated (prevents cross-conduction) |
| Supply Voltage (VCC) | 15 V typical | β |
| Bootstrap Supply (VB) | up to 500 V + 15 V | β |
| Under-Voltage Lockout (UVLO) | Yes (VCC and VBS) | β |
| Logic Input Voltage (HIN/LIN) | 3.3 V / 5 V compatible | β |
| Fault Output | Yes (active-low FAULT pin) | β |
| Operating Temperature Range | -40C to +125C (TJ) | -40C to +125C (junction) |
| Package | 31-PQFN 8x9 mm (also called QFN 8x9, isolated) | 31-PQFN (8x9 mm) with exposed thermal pad |
| Isolation Voltage | 1500 Vrms (per package, functional isolation) | β |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | 3 | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant | Compliant |
| Continuous Output Current | β | 10 A |
| Continuous Motor Power | β | 200 W |
| Power Switch Technology | β | Trench FREDFET (low RDS(on) MOSFET) |
| Logic Supply Voltage (VCC) | β | 13.5 V to 16.5 V |
| Bootstrap Diode | β | Integrated |
| Protection Features | β | Over-current, Under-voltage lockout (UVLO), Thermal shutdown |
| Logic Input Compatibility | β | 3.3 V / 5 V CMOS |
| Isolation | β | Electrically isolated thermal pad (high-voltage creepage per IPM package) |