IRSM808-105MH vs IRSM808-105MHTR Vergleich
Detaillierter Direktvergleich von IRSM808-105MH von Infineon und IRSM808-105MHTR von Infineon. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | IRSM808-105MH | IRSM808-105MHTR |
|---|---|---|
| Marke | Infineon | Infineon |
| Kategorie | Motor Drivers | Motor Drivers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,65 | $2,31 |
| Topologie | Half-bridge (2 FREDFET switches + HVIC driver) | Half-Bridge (High-Side + Low-Side) |
| Drain-Source Blocking Voltage (VDS) | 500 V | 500 V |
| Continuous Drain Current (ID @ TC=25C) | 10 A | — |
| Static Drain-Source On-Resistance (RDS(on)) | 0.8 ohm max | — |
| Maximum Switching Power | 200 W | — |
| Gate Driver | Integrated HVIC (half-bridge, bootstrap) | Integrated high-voltage level-shift HVIC |
| Dead-Time Generation | Internal (configurable via DT pin) | Integrated (prevents cross-conduction) |
| Supply Voltage (VCC) | 15 V typical | — |
| Bootstrap Supply (VB) | up to 500 V + 15 V | — |
| Under-Voltage Lockout (UVLO) | Yes (VCC and VBS) | — |
| Logic Input Voltage (HIN/LIN) | 3.3 V / 5 V compatible | — |
| Fault Output | Yes (active-low FAULT pin) | — |
| Betriebstemperaturbereich | -40C to +125C (TJ) | -40C to +125C (junction) |
| Gehäuse | 31-PQFN 8x9 mm (also called QFN 8x9, isolated) | 31-PQFN (8x9 mm) with exposed thermal pad |
| Isolation Voltage | 1500 Vrms (per package, functional isolation) | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant | Compliant |
| Continuous Output Current | — | 10 A |
| Continuous Motor Power | — | 200 W |
| Power Switch Technology | — | Trench FREDFET (low RDS(on) MOSFET) |
| Logic Supply Voltage (VCC) | — | 13.5 V to 16.5 V |
| Bootstrap Diode | — | Integrated |
| Protection Features | — | Over-current, Under-voltage lockout (UVLO), Thermal shutdown |
| Logic Input Compatibility | — | 3.3 V / 5 V CMOS |
| Isolation | — | Electrically isolated thermal pad (high-voltage creepage per IPM package) |