IS43TR16256AL-125KBLI-TR vs MT41K128M16JT Comparison
Detailed side-by-side comparison of IS43TR16256AL-125KBLI-TR by ISSI, Integrated Silicon Solution Inc and MT41K128M16JT by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
ISSI, Integrated Silicon Solution Inc
IS43TR16256AL-125KBLI-TR - 4Gbit DDR3L SDRAM 256Mx16 | ISSI
IS43TR16256AL-125KBLI-TR ✓ Active
Specification Comparison
| Parameter | IS43TR16256AL-125KBLI-TR | MT41K128M16JT |
|---|---|---|
| Brand | ISSI, Integrated Silicon Solution Inc | Micron Technology |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8.25 | $9.20 |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM |
| Memory Size | 4Gbit (256M x 16) | — |
| Data Bus Width | 16 bit | — |
| Clock Frequency | 800 MHz | — |
| Data Rate | 1600 Mbps | — |
| CAS Latency | 11 | — |
| Supply Voltage (VDD/VDDQ) | 1.35V ± 0.1V, -0.067V | 1.35 V (typ) / 1.283 V to 1.45 V (DDR3L) |
| Backward Compatible Voltage | 1.5V | — |
| Row Cycle Time (tRC) | 20 ns | — |
| Row Active Time (tRAS) | 20 ns | — |
| Operating Temperature Range | -40°C to +95°C (TC) | — |
| Package | 96-TWBGA (9x13 mm) | 96-FBGA (8 mm x 14 mm, 0.8 mm pitch) |
| Mounting Type | Surface Mount | Surface Mount (FBGA) |
| Burst Length | 8 | — |
| On-Die Termination (ODT) | Yes | — |
| Refresh Modes | Auto-refresh, Self-refresh | — |
| RoHS Status | Compliant | Compliant (Pb-free FBGA) |
| Density | — | 2 Gbit |
| Organization | — | 128M x 16 |
| Banks | — | 8 banks |
| Prefetch Architecture | — | 8n-bit prefetch |
| Access Time | — | 0.225 ns (CK to DQ, -125 bin) |
| Cycle Time | — | 1.25 ns (-125 bin) / 1.07 ns (-107 bin) |
| Max Data Rate | — | 1600 MT/s (-125) / 1866 MT/s (-107) |
| Operating Temperature | — | 0C to +95C (commercial, no suffix) |
| Industrial Temperature Option | — | -40C to +95C (IT suffix) |
| Automotive Temperature Option | — | -40C to +105C (AAT) / -40C to +95C (AIT) |
| Process Technology | — | CMOS |
| On-Die Termination | — | Dynamic ODT (nominal/weak/strong) |
| Calibration | — | ZQ calibration (240 ohm ext. resistor) |
| Refresh | — | Auto self-refresh (ASR) |
| Write Feature | — | Write leveling + data mask |