IS43TR16256AL-125KBLI-TR vs MT41K128M16JT Comparación
Comparación detallada lado a lado de IS43TR16256AL-125KBLI-TR por ISSI, Integrated Silicon Solution Inc y MT41K128M16JT por Micron Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
ISSI, Integrated Silicon Solution Inc
IS43TR16256AL-125KBLI-TR - 4Gbit DDR3L SDRAM 256Mx16 | ISSI
IS43TR16256AL-125KBLI-TR ✓ Activo
Comparación de especificaciones
| Parámetro | IS43TR16256AL-125KBLI-TR | MT41K128M16JT |
|---|---|---|
| Marca | ISSI, Integrated Silicon Solution Inc | Micron Technology |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,25 | $9,20 |
| Tipo de memoria | DDR3L SDRAM | DDR3L SDRAM |
| Tamaño de memoria | 4Gbit (256M x 16) | — |
| Ancho del bus de datos | 16 bit | — |
| Clock Frequency | 800 MHz | — |
| Velocidad de datos | 1600 Mbps | — |
| Latencia CAS | 11 | — |
| Supply Voltage (VDD/VDDQ) | 1.35V ± 0.1V, -0.067V | 1.35 V (typ) / 1.283 V to 1.45 V (DDR3L) |
| Backward Compatible Voltage | 1.5V | — |
| Row Cycle Time (tRC) | 20 ns | — |
| Row Active Time (tRAS) | 20 ns | — |
| Rango de temperatura de funcionamiento | -40°C to +95°C (TC) | — |
| Encapsulado | 96-TWBGA (9x13 mm) | 96-FBGA (8 mm x 14 mm, 0.8 mm pitch) |
| Tipo de montaje | Surface Mount | Surface Mount (FBGA) |
| Burst Length | 8 | — |
| On-Die Termination (ODT) | Yes | — |
| Refresh Modes | Auto-refresh, Self-refresh | — |
| Estado RoHS | Compliant | Compliant (Pb-free FBGA) |
| Density | — | 2 Gbit |
| Organización de memoria | — | 128M x 16 |
| Banks | — | 8 banks |
| Prefetch Architecture | — | 8n-bit prefetch |
| Access Time | — | 0.225 ns (CK to DQ, -125 bin) |
| Cycle Time | — | 1.25 ns (-125 bin) / 1.07 ns (-107 bin) |
| Max Data Rate | — | 1600 MT/s (-125) / 1866 MT/s (-107) |
| Temperatura de funcionamiento | — | 0C to +95C (commercial, no suffix) |
| Industrial Temperature Option | — | -40C to +95C (IT suffix) |
| Automotive Temperature Option | — | -40C to +105C (AAT) / -40C to +95C (AIT) |
| Process Technology | — | CMOS |
| On-Die Termination | — | Dynamic ODT (nominal/weak/strong) |
| Calibration | — | ZQ calibration (240 ohm ext. resistor) |
| Refresh | — | Auto self-refresh (ASR) |
| Write Feature | — | Write leveling + data mask |