IS43TR16256AL-125KBLI-TR vs MT41K128M16JT Vergleich
Detaillierter Direktvergleich von IS43TR16256AL-125KBLI-TR von ISSI, Integrated Silicon Solution Inc und MT41K128M16JT von Micron Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
ISSI, Integrated Silicon Solution Inc
IS43TR16256AL-125KBLI-TR - 4Gbit DDR3L SDRAM 256Mx16 | ISSI
IS43TR16256AL-125KBLI-TR ✓ Aktiv
Spezifikationsvergleich
| Parameter | IS43TR16256AL-125KBLI-TR | MT41K128M16JT |
|---|---|---|
| Marke | ISSI, Integrated Silicon Solution Inc | Micron Technology |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,25 | $9,20 |
| Speichertyp | DDR3L SDRAM | DDR3L SDRAM |
| Speichergröße | 4Gbit (256M x 16) | — |
| Datenbusbreite | 16 bit | — |
| Clock Frequency | 800 MHz | — |
| Datenrate | 1600 Mbps | — |
| CAS-Latenz | 11 | — |
| Supply Voltage (VDD/VDDQ) | 1.35V ± 0.1V, -0.067V | 1.35 V (typ) / 1.283 V to 1.45 V (DDR3L) |
| Backward Compatible Voltage | 1.5V | — |
| Row Cycle Time (tRC) | 20 ns | — |
| Row Active Time (tRAS) | 20 ns | — |
| Betriebstemperaturbereich | -40°C to +95°C (TC) | — |
| Gehäuse | 96-TWBGA (9x13 mm) | 96-FBGA (8 mm x 14 mm, 0.8 mm pitch) |
| Montageart | Surface Mount | Surface Mount (FBGA) |
| Burst Length | 8 | — |
| On-Die Termination (ODT) | Yes | — |
| Refresh Modes | Auto-refresh, Self-refresh | — |
| RoHS-Status | Compliant | Compliant (Pb-free FBGA) |
| Density | — | 2 Gbit |
| Speicherorganisation | — | 128M x 16 |
| Banks | — | 8 banks |
| Prefetch Architecture | — | 8n-bit prefetch |
| Access Time | — | 0.225 ns (CK to DQ, -125 bin) |
| Cycle Time | — | 1.25 ns (-125 bin) / 1.07 ns (-107 bin) |
| Max Data Rate | — | 1600 MT/s (-125) / 1866 MT/s (-107) |
| Betriebstemperatur | — | 0C to +95C (commercial, no suffix) |
| Industrial Temperature Option | — | -40C to +95C (IT suffix) |
| Automotive Temperature Option | — | -40C to +105C (AAT) / -40C to +95C (AIT) |
| Process Technology | — | CMOS |
| On-Die Termination | — | Dynamic ODT (nominal/weak/strong) |
| Calibration | — | ZQ calibration (240 ohm ext. resistor) |
| Refresh | — | Auto self-refresh (ASR) |
| Write Feature | — | Write leveling + data mask |