K4A4G085WD-BCRC vs K4A4G045WD-BCPB Comparison
Detailed side-by-side comparison of K4A4G085WD-BCRC by Samsung Electronics and K4A4G045WD-BCPB by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4A4G085WD-BCRC | K4A4G045WD-BCPB |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.58 | $2.20 |
| Memory Density | 4 Gbit | — |
| Organization | 512M x 8 | 1G x 4 |
| Memory Type | DDR4 SDRAM (D-die) | DDR4 SDRAM |
| Data Rate | 2400 Mb/s (PC2400) | — |
| Supply Voltage | 1.2 V | 1.2 V |
| Package | FBGA-78 (TFBGA) | 78-ball TFBGA (FBGA) |
| Number of Terminals | 78 | 78 |
| Interface | Parallel | DDR4 parallel, double data rate |
| Access Mode | Multi-bank page burst | — |
| Mounting Type | Surface Mount | Surface Mount |
| CAS Latency | [DATA_NEEDED: CAS Latency] | — |
| Operating Temperature Range | [DATA_NEEDED: Operating Temperature Range] | — |
| Refresh | [DATA_NEEDED: Refresh specification] | — |
| RoHS Status | [DATA_NEEDED: RoHS Status] | — |
| MSL Level | [DATA_NEEDED: MSL Level] | — |
| Density | — | 4 Gb |
| Speed Class | — | DDR4-2133 (PC2133) |
| Die Generation | — | D-die |
| Terminal Form | — | Ball (BGA) |
| Package Shape | — | Rectangular |
| Burst Length | — | 8 (per Samsung DDR4 SDRAM datasheet Rev. 1.1) |
| Speed Bin Notation | — | CL-tRCD-tRP order (per Samsung ordering information) |
| Datasheet Pages | — | 66 pages (K4A4G045WD / K4A4G085WD family) |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |
| Refresh Rate | — | [DATA_NEEDED: refresh interval 1x/2x/4x support] |