K4A4G085WD-BCRC - 4Gb DDR4-2400 SDRAM 512Mx8 | Samsung
MPN: K4A4G085WD-BCRC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.26 | $4.26 |
| 10 | $4.1 | $41.00 |
| 100 | $3.92 | $392.00 |
| 500 | $3.75 | $1,875.00 |
| 1,000 | $3.58 | $3,580.00 |
Drop-in alternatives for K4A4G085WD-BCRC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4A4G085WD-BCPB
✅ Drop-In📋 Reference alternative (not in catalog)
K4A4G085WE-BCRC
✅ Drop-In✓ In Stock
$1.36 / Unit
View Datasheet →K4A4G045WD-BCRC
✅ Drop-In✓ In Stock
$3.45 / Unit
View Datasheet →K4A4G045WD-BCPB
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →MT40A512M8RH-075E:B
✅ Drop-In✓ In Stock
$2.15 / Unit
View Datasheet →K4A4G085WD-BCRC Maximum Ratings & Electrical Characteristics
| Memory Density | 4 Gbit |
| Organization | 512M x 8 |
| Memory Type | DDR4 SDRAM (D-die) |
| Data Rate | 2400 Mb/s (PC2400) |
| Supply Voltage | 1.2 V |
| Package | FBGA-78 (TFBGA) |
| Number of Terminals | 78 |
| Interface | Parallel |
| Access Mode | Multi-bank page burst |
| Mounting Type | Surface Mount |
K4A4G085WD-BCRC fbga-78 (tfbga) Pin Configuration Guide
Complete pinout information for K4A4G085WD-BCRC (fbga-78 (tfbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4A4G085WD-BCRC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A4G085WD-BCRC is suitable for 6 applications: Industrial Controllers, Embedded Computing Modules, FPGA-Based Data Acquisition, Firmware Boot and Logging, Networking Equipment, DDR3-to-DDR4 Migration Replacements.
Industrial Controllers
Industrial PLCs and motion controllers rely on DRAM for run-time data, recipe storage buffering, and firmware execution. The K4A4G085WD-BCRC fits this role with 4Gb of DDR4 at 2400 Mb/s, providing up to 2.4 GB/s of peak bandwidth per device on a x8 bus, which is ample for deterministic control loops and HMI buffering. Its 1.2V supply keeps system power low, important in sealed fanless enclosures, and the 78-ball FBGA package (approximately 7.5 x 9.5 mm class footprint) mounts on compact industrial PCBs. Designers typically pair it with an embedded processor or FPGA hard DDR4 controller and validate across the industrial temperature range before release.
Recommended
Embedded Computing Modules
COMs and SoMs based on ARM or x86 SoCs use x8 DDR4 devices to populate 64-bit memory buses. Eight K4A4G085WD-BCRC devices yield 4GB on a 64-bit bus at DDR4-2400, matching the memory requirements of Linux-based gateways and edge computing nodes. The device's 1.2V JEDEC DDR4 interface interoperates with standard memory controllers from all major silicon vendors, and the fly-by address/command routing used in DDR4 keeps PCB layer count manageable. Memory sizing at 4Gb per device balances density against cost, making it a common BOM line for volume module production and second-source qualification alongside Micron equivalents.
Recommended
FPGA-Based Data Acquisition
High-speed data acquisition systems use FPGA memory controllers (Xilinx MIG, Intel EMIF) to buffer ADC streams into DDR4. The K4A4G085WD-BCRC offers 4Gb of buffering per chip; with 2400 Mb/s transfer rates and multi-bank page burst access, a x8 device sustains the sustained-write bandwidth needed for streaming applications. Its 1.2V interface reduces I/O power compared to DDR3, which matters in dense acquisition cards with dozens of memory chips. Designers should budget controller calibration (write leveling, read training) time at startup and route DQS/DQ as length-matched pairs with on-die termination (ODT) tuning to meet signal integrity targets at speed.
Recommended
Firmware Boot and Logging
Embedded systems execute firmware from DRAM after boot code loads from flash, and log operational data to memory before committing to storage. The K4A4G085WD-BCRC provides 4Gb of fast execution memory with DDR4-2400 bandwidth, accelerating boot decompression and application runtime versus DDR3 or lower-density solutions. Distributor listings (globalspec) explicitly cite firmware boot and embedded logging among its target uses. Its x8 data mask support enables efficient partial writes for logging workloads. Pair with a supervisor device to guarantee clean power sequencing so that DDR4 initialization and memory training complete reliably at every power cycle.
Recommended
Networking Equipment
Routers, switches, and network appliances use DDR4 for packet buffers, routing tables, and control-plane software. The K4A4G085WD-BCRC delivers 4Gb per device with DDR4-2400 bandwidth, and its x8 organization allows flexible bus width scaling - from single-chip 8-bit designs in edge devices to 64-bit ranks in aggregation equipment. The 1.2V operation reduces total platform power, a key metric in always-on networking hardware where every watt affects thermal design and operating cost. The 78-ball FBGA package supports the dense memory arrangements typical of switch line cards, and second sourcing with Micron equivalents protects supply continuity for long-life network products.
Recommended
DDR3-to-DDR4 Migration Replacements
Designs migrating from DDR3 platforms such as MT47H32M16NF-25E-based systems to DDR4 can adopt the K4A4G085WD-BCRC to gain double the density per die shrink and roughly 30-40% lower I/O power at 1.2V versus DDR3L. Distributor cross-reference data (IC-Components) positions this Samsung D-die part as a replacement-sourcing candidate alongside Micron and SK Hynix equivalents. Migration requires a DDR4-capable controller, revised power tree (1.2V rails and VTT), and PCB respin for the FBGA footprint, but the payoff is higher bandwidth (2400 Mb/s class), lower standby power, and an active, multi-sourced supply base for long production lifetimes.
Recommended
Recommended Products Summary
Engineering reference data for K4A4G085WD-BCRC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A4G085WD-BCPB | K4A4G085WE-BCRC | MT40A512M8RH-075E:B |
|---|---|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Package | FBGA-78 (TFBGA) | FBGA-78 (TFBGA) - same | FBGA-78 (TFBGA) - same | FBGA (DDR4 standard ballout) |
| Density | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Organization | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 |
| Data Rate | 2400 Mb/s (PC2400) | [DATA_NEEDED] | DDR4-2400 class | -075 speed bin (DDR4-2400 class) |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Die Generation | D-die | D-die | E-die (newer) | Micron E-die class |
| Unit Price (qty 1) | $4.26 (as of 2026-09-04) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| RoHS | [DATA_NEEDED] | Lead-free (PB designation) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Samsung D-die 4Gb density with established production history (vs K4A4G085WE-BCRC)
- Multi-vendor drop-in second sourcing at identical 512M x 8 organization (vs MT40A512M8RH-075E:B)
- Full 4Gb capacity vs family 2Gb variants in same footprint (vs K4A4G045WD-BCRC)
Design Notes
Supply the K4A4G085WD-BCRC from a clean 1.2V rail per the JEDEC DDR4 standard. Use separate decoupling for VDD (core) and VDDQ (I/O): a bulk 47-100 uF capacitor per device group plus 0.1 uF ceramics at each supply ball. Generate the VTT termination rail (0.6V) with a dedicated sink-source LDO or DDR termination regulator sized for the fly-by bus load. Estimated: at DDR4-2400 with ODT enabled, per-device VDDQ current is typically in the tens-to-low-hundreds of mA range depending on bus utilization - verify against the datasheet IDD specifications for your actual speed bin and use pattern.
DDR4 uses fly-by routing for address/command/clock with on-die termination, while DQ/DQS pairs require strict length matching within each byte lane (typically +/-5 mil intra-pair). Keep the 78-ball FBGA fanout to a dedicated inner layer pair with a solid reference plane; avoid splitting the reference under DQS strobes. Match trace lengths among the eight devices of a 64-bit rank and place the first device closest to the controller. These constraints are standard JEDEC DDR4 layout practice and should be validated with SI simulation at 2400 Mb/s.
The most common failure mode when second-sourcing DDR4 is skipping controller re-training: even pin-compatible parts from different die generations (D-die vs E-die, or Micron vs Samsung) can require different write-leveling and read-eye training results. Ensure your bootloader runs full DDR4 training every power-up rather than using hardcoded training values. Also confirm the ordering code suffix: -BCRC vs -BCPB differ in ball/plating finish (RC vs PB designation), which can matter for soldering profiles and moisture sensitivity handling per the package MSL rating.
Compliance Information
Compliance status not explicitly stated in the provided web data. The PB-suffix Samsung variants are lead-free ball/plating designations; verify RoHS/REACH declarations via the Samsung Semiconductor product page.
