K4A8G085WB-BCPB vs K4A8G085WB Comparison
Detailed side-by-side comparison of K4A8G085WB-BCPB by Samsung Electronics and K4A8G085WB by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4A8G085WB-BCPB | K4A8G085WB |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $13.78 | $5.20 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM (B-die) |
| Density | 8 Gbit | 8 Gbit |
| Organization | 1G x 8 | 1G x 8 |
| Supply Voltage | 1.2 V (nominal) | 1.2 V |
| Data Rate | 3200 Mbps (PC4-25600) | [DATA_NEEDED: speed grade data rate in Mbps] |
| Speed Grade | BC | — |
| CAS Latency (CL) | 22 | — |
| Burst Length | 8 | — |
| Bank Architecture | 16 banks (4 bank groups) | — |
| Refresh Interval | 7.8 us (up to 85C) | — |
| Interface Type | SSTL-12 | — |
| Termination | ODT / dynamic ODT | — |
| Self-Refresh | Temperature-Compensated Self-Refresh (TCSR) | — |
| Package | 78-ball FBGA | 78-pin FBGA |
| Package Dimensions | 11 mm x 11 mm | [DATA_NEEDED: package dimensions] |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Operating Mode | DLL enabled | DLL Enabled mode (per datasheet) |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Speed Grade Suffixes | — | -BCRC, -BIRC, -BCTD, -BCPB (per family naming) |
| tCL/cas latency | — | [DATA_NEEDED: CAS latency] |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |
| Refresh | — | [DATA_NEEDED: refresh rate 1x/2x] |
| Bank Groups | — | [DATA_NEEDED: bank/bank group count] |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |
| Termination Voltage (VTT) | — | [DATA_NEEDED: VTT value] |