K4A8G085WB-BCPB vs K4A8G085WB Vergleich
Detaillierter Direktvergleich von K4A8G085WB-BCPB von Samsung Electronics und K4A8G085WB von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | K4A8G085WB-BCPB | K4A8G085WB |
|---|---|---|
| Marke | Samsung Electronics | Samsung Electronics |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,78 | $5,20 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM (B-die) |
| Density | 8 Gbit | 8 Gbit |
| Speicherorganisation | 1G x 8 | 1G x 8 |
| Versorgungsspannung | 1.2 V (nominal) | 1.2 V |
| Datenrate | 3200 Mbps (PC4-25600) | [DATA_NEEDED: speed grade data rate in Mbps] |
| Speed Grade | BC | — |
| CAS Latency (CL) | 22 | — |
| Burst Length | 8 | — |
| Bank Architecture | 16 banks (4 bank groups) | — |
| Refresh Interval | 7.8 us (up to 85C) | — |
| Schnittstellentyp | SSTL-12 | — |
| Termination | ODT / dynamic ODT | — |
| Self-Refresh | Temperature-Compensated Self-Refresh (TCSR) | — |
| Gehäuse | 78-ball FBGA | 78-pin FBGA |
| Package Dimensions | 11 mm x 11 mm | [DATA_NEEDED: package dimensions] |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Operating Mode | DLL enabled | DLL Enabled mode (per datasheet) |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Speed Grade Suffixes | — | -BCRC, -BIRC, -BCTD, -BCPB (per family naming) |
| tCL/cas latency | — | [DATA_NEEDED: CAS latency] |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Refresh | — | [DATA_NEEDED: refresh rate 1x/2x] |
| Bank Groups | — | [DATA_NEEDED: bank/bank group count] |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |
| Termination Voltage (VTT) | — | [DATA_NEEDED: VTT value] |