K4A8G085WB-BICH vs K4A8G085WB-BICR Comparison
Detailed side-by-side comparison of K4A8G085WB-BICH by Samsung Electronics and K4A8G085WB-BICR by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G085WB-BICR - Samsung 8Gb DDR4 1Gx8 2400Mbps Industrial
K4A8G085WB-BICR ✓ ActiveSpecification Comparison
| Parameter | K4A8G085WB-BICH | K4A8G085WB-BICR |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.96 | $4.25 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8Gb | 8 Gb |
| Organization | 1G x 8 | 1G x 8 |
| Supply Voltage | 1.2V | 1.2 V (VDD/VDDQ) |
| Data Rate | 2400 Mbps (DDR4-2400) | 2400 Mbps |
| Package | 78-ball FBGA | 78-ball FBGA |
| Operating Temperature | 0°C to 85°C | — |
| Max Supply Current | 170mA | — |
| Burst Length | BL8, BL16 | — |
| CAS Latency | Programmable | — |
| On-Die ECC | Yes | — |
| Data Bus Inversion | Yes | — |
| RoHS | Compliant | — |
| Lead-Free | Yes | Yes |
| Die Revision | B-die | — |
| Number of Banks | — | 16 |
| Refresh Cycles | — | 8192 |
| Pin Count | — | 78 |
| Mounting Type | — | Surface Mount |
| Temperature Grade | — | Industrial (I-grade) |
| Operating Temperature Range | — | [DATA_NEEDED: exact temperature range for BICR industrial suffix] |
| Die / Process | — | Samsung 8Gb B-die DDR4 |
| Speed Grade | — | DDR4-2400 (PC4-19200) |
| RoHS Status | — | Compliant |
| Refresh Management | — | Row refresh, auto-refresh and self-refresh supported |