K4A8G085WC-BCPB vs K4A8G085WB-BCPB Comparison
Detailed side-by-side comparison of K4A8G085WC-BCPB by Samsung Electronics and K4A8G085WB-BCPB by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G085WC-BCPB - 8Gb DDR4 SDRAM 2133Mbps 1.2V | Samsung
K4A8G085WC-BCPB ✗ End of Life
Specification Comparison
| Parameter | K4A8G085WC-BCPB | K4A8G085WB-BCPB |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | DRAM | Memory ICs |
| Lifecycle Status | End of Life | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.95 | $13.78 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gbit |
| Organization | 1G x 8 | 1G x 8 |
| Data Rate | 2133 Mbps | 3200 Mbps (PC4-25600) |
| Supply Voltage | 1.2 V | 1.2 V (nominal) |
| Operating Temperature | 0 C to +85 C | — |
| Package | 78FBGA | 78-ball FBGA |
| Number of Terminals | 78 | — |
| Maximum Seated Height | 1.2 mm | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Speed Grade | DDR4-2133 | BC |
| Features | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask | — |
| Refresh | [DATA_NEEDED: refresh rate 1x/2x] | — |
| CAS Latency | [DATA_NEEDED: CAS latency] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Die Revision | [DATA_NEEDED: die revision] | — |
| Standard Package Quantity | [DATA_NEEDED: standard package quantity] | — |
| CAS Latency (CL) | — | 22 |
| Burst Length | — | 8 |
| Bank Architecture | — | 16 banks (4 bank groups) |
| Refresh Interval | — | 7.8 us (up to 85C) |
| Interface Type | — | SSTL-12 |
| Termination | — | ODT / dynamic ODT |
| Self-Refresh | — | Temperature-Compensated Self-Refresh (TCSR) |
| Package Dimensions | — | 11 mm x 11 mm |
| Operating Mode | — | DLL enabled |