K4A8G085WC-BCRC vs H5AN4G8NBJR-UHC Comparison

Detailed side-by-side comparison of K4A8G085WC-BCRC by Samsung Electronics and H5AN4G8NBJR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4A8G085WC-BCRC K4A8G085WC-BCRC - 8Gb DDR4 SDRAM 2400Mbps | Samsung

K4A8G085WC-BCRC - 8Gb DDR4 SDRAM 2400Mbps | Samsung

K4A8G085WC-BCRC ✓ Active
SK hynix
H5AN4G8NBJR-UHC H5AN4G8NBJR-UHC - 4Gb DDR4 SDRAM 2400, 1.2V | SK Hynix

H5AN4G8NBJR-UHC - 4Gb DDR4 SDRAM 2400, 1.2V | SK Hynix

H5AN4G8NBJR-UHC ✓ Active

Specification Comparison

Parameter K4A8G085WC-BCRC H5AN4G8NBJR-UHC
Brand Samsung Electronics SK hynix
Category DRAM Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $4.30 $3.18
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 8 Gbit 4 Gbit
Organization 1G x 8 512M x 8
Supply Voltage 1.2 V 1.2 V
Data Rate 2400 Mbps (DDR4-2400) 2400 Mbps (PC2400)
Package 78-ball FBGA (TFBGA) TFBGA-78 (11 x 7.5 mm)
Terminal Pitch 0.8 mm —
Mounting Type Surface Mount Surface Mount
Operating Temperature 0C to +95C [DATA_NEEDED: operating temperature range]
Auto Precharge Yes —
Asynchronous Reset Yes —
CRC Function Yes —
ZQ Calibration Yes —
Dynamic On-Die Termination Yes —
Data Mask Function Yes —
RoHS Status Compliant Compliant (Rohs Code: Yes)
Refresh Auto/Self refresh [DATA_NEEDED: refresh rate 1x/2x/4x support]
Interface — DDR4 (JEDEC)
Technology — CMOS DRAM
Lifecycle Code — Active
REACH Compliance — Compliant
Manufacturer — SK Hynix Inc.
CAS Latency — [DATA_NEEDED: CAS latency for -UHC speed bin]

Datasheets & Resources

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