K4A8G085WC-BCRC vs K4A8G165WB-BCRC Comparison
Detailed side-by-side comparison of K4A8G085WC-BCRC by Samsung Electronics and K4A8G165WB-BCRC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G165WB-BCRC - 8Gb DDR4 SDRAM x16 2400Mbps | Samsung
K4A8G165WB-BCRC ✓ ActiveSpecification Comparison
| Parameter | K4A8G085WC-BCRC | K4A8G165WB-BCRC |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | DRAM | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.30 | $12.57 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM (DRAM, volatile) |
| Density | 8 Gbit | — |
| Organization | 1G x 8 | — |
| Supply Voltage | 1.2 V | 1.2 V (1.14 V to 1.26 V) |
| Data Rate | 2400 Mbps (DDR4-2400) | 2400 Mbps (PC4-19200) |
| Package | 78-ball FBGA (TFBGA) | 96-ball FBGA (PBGA96) |
| Terminal Pitch | 0.8 mm | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0C to +95C | -40C to +95C |
| Auto Precharge | Yes | Yes |
| Asynchronous Reset | Yes | Yes |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | Yes |
| Dynamic On-Die Termination | Yes | — |
| Data Mask Function | Yes | — |
| RoHS Status | Compliant | Compliant |
| Refresh | Auto/Self refresh | Auto-refresh and self-refresh |
| Memory Size | — | 8 Gb (1 GB) |
| Memory Organization | — | 512M x 16 |
| Technology | — | CMOS DRAM, Samsung 8Gb B-die |
| Ball Pitch | — | 0.8 mm |
| Interface | — | DDR4 (Double Data Rate, synchronous) |
| On-Die Termination | — | Yes (ODT with dynamic ODT) |
| CRC / CA Parity | — | Yes (CRC function) |