K4A8G085WC-BIWE vs K4A8G085WB Comparison

Detailed side-by-side comparison of K4A8G085WC-BIWE by Samsung Electronics and K4A8G085WB by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4A8G085WC-BIWE K4A8G085WC-BIWE - 8Gb DDR4-3200 1Gx8 DRAM | Samsung

K4A8G085WC-BIWE - 8Gb DDR4-3200 1Gx8 DRAM | Samsung

K4A8G085WC-BIWE ✓ Active
Samsung Electronics
K4A8G085WB K4A8G085WB - 8Gb B-die DDR4 SDRAM 1Gx8 | Samsung

K4A8G085WB - 8Gb B-die DDR4 SDRAM 1Gx8 | Samsung

K4A8G085WB ✓ Active

Specification Comparison

Parameter K4A8G085WC-BIWE K4A8G085WB
Brand Samsung Electronics Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.29 $5.20
Memory Type DDR4 SDRAM DDR4 SDRAM (B-die)
Density 8 Gb 8 Gbit
Organization 1G x 8 1G x 8
Data Rate 3200 Mbps [DATA_NEEDED: speed grade data rate in Mbps]
Supply Voltage (VDD) 1.2 V —
Supply Voltage (VDDQ) 1.2 V —
Operating Temperature Range -40°C to +95°C —
Package 78-FBGA 78-pin FBGA
Mounting Type Surface Mount Surface Mount
Interface POD-12 —
Burst Length 8 (BL8), 4 (BC4) —
CAS Latency 22 (CL22) —
Refresh Auto-refresh, self-refresh [DATA_NEEDED: refresh rate 1x/2x]
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Lead-Free Yes —
Supply Voltage — 1.2 V
Operating Mode — DLL Enabled mode (per datasheet)
Speed Grade Suffixes — -BCRC, -BIRC, -BCTD, -BCPB (per family naming)
tCL/cas latency — [DATA_NEEDED: CAS latency]
Operating Temperature — [DATA_NEEDED: operating temperature range]
Bank Groups — [DATA_NEEDED: bank/bank group count]
Package Dimensions — [DATA_NEEDED: package dimensions]
MSL Level — [DATA_NEEDED: moisture sensitivity level]
Termination Voltage (VTT) — [DATA_NEEDED: VTT value]

Datasheets & Resources

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