K4A8G165WB-BCTD vs AS4C512M16D4A-62BCN Comparison

Detailed side-by-side comparison of K4A8G165WB-BCTD by Samsung Electronics and AS4C512M16D4A-62BCN by Alliance Memory. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4A8G165WB-BCTD K4A8G165WB-BCTD - 8Gb DDR4 SDRAM x16 | Samsung

K4A8G165WB-BCTD - 8Gb DDR4 SDRAM x16 | Samsung

K4A8G165WB-BCTD ✓ Active
Alliance Memory
AS4C512M16D4A-62BCN AS4C512M16D4A-62BCN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BCN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BCN ✓ Active

Specification Comparison

Parameter K4A8G165WB-BCTD AS4C512M16D4A-62BCN
Brand Samsung Electronics Alliance Memory
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $37.00 $7.20
Memory Type DDR4 SDRAM DDR4 SDRAM
Organization 512M x 16 512M x 16
Total Density 8 Gb —
Data Rate 2666 Mbps/pin (PC4-2666) 1600 MHz (3200 Mbps)
Supply Voltage 1.2 V 1.2 V
Package 96-ball FBGA 96-FBGA (7.5x13 mm)
Operating Temperature 0°C to +95°C (TC) 0°C to 95°C
CAS Latency [DATA_NEEDED: CL value] 18 ns
tRCD [DATA_NEEDED: tRCD value] —
tRP [DATA_NEEDED: tRP value] —
Refresh Auto-refresh, self-refresh Auto-refresh and self-refresh
On-Die Termination Yes (ODT) Yes
ZQ Calibration Yes —
Data Mask Yes —
RoHS Compliant —
Memory Size — 8 Gbit
Mounting Type — Surface Mount
JEDEC Standard — Compliant
Interface — POD (Pseudo Open Drain)
RoHS Status — Compliant
Packaging — Tray

Datasheets & Resources

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