K4A8G165WB-BCTD vs K4A8G165WB-BCRC Comparison

Detailed side-by-side comparison of K4A8G165WB-BCTD by Samsung Electronics and K4A8G165WB-BCRC by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4A8G165WB-BCTD K4A8G165WB-BCTD - 8Gb DDR4 SDRAM x16 | Samsung

K4A8G165WB-BCTD - 8Gb DDR4 SDRAM x16 | Samsung

K4A8G165WB-BCTD βœ“ Active
Samsung Electronics
K4A8G165WB-BCRC K4A8G165WB-BCRC - 8Gb DDR4 SDRAM x16 2400Mbps | Samsung

K4A8G165WB-BCRC - 8Gb DDR4 SDRAM x16 2400Mbps | Samsung

K4A8G165WB-BCRC βœ“ Active

Specification Comparison

Parameter K4A8G165WB-BCTD K4A8G165WB-BCRC
Brand Samsung Electronics Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $37.00 $12.57
Memory Type DDR4 SDRAM DDR4 SDRAM (DRAM, volatile)
Organization 512M x 16 β€”
Total Density 8 Gb β€”
Data Rate 2666 Mbps/pin (PC4-2666) 2400 Mbps (PC4-19200)
Supply Voltage 1.2 V 1.2 V (1.14 V to 1.26 V)
Package 96-ball FBGA 96-ball FBGA (PBGA96)
Operating Temperature 0Β°C to +95Β°C (TC) -40C to +95C
CAS Latency [DATA_NEEDED: CL value] β€”
tRCD [DATA_NEEDED: tRCD value] β€”
tRP [DATA_NEEDED: tRP value] β€”
Refresh Auto-refresh, self-refresh Auto-refresh and self-refresh
On-Die Termination Yes (ODT) Yes (ODT with dynamic ODT)
ZQ Calibration Yes Yes
Data Mask Yes β€”
RoHS Compliant β€”
Memory Size β€” 8 Gb (1 GB)
Memory Organization β€” 512M x 16
Technology β€” CMOS DRAM, Samsung 8Gb B-die
Ball Pitch β€” 0.8 mm
Mounting Type β€” Surface Mount
Interface β€” DDR4 (Double Data Rate, synchronous)
CRC / CA Parity β€” Yes (CRC function)
Auto Precharge β€” Yes
Asynchronous Reset β€” Yes
RoHS Status β€” Compliant

Datasheets & Resources

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