K4A8G165WB-BCWE vs NT5AD512M16B4-HR Comparison

Detailed side-by-side comparison of K4A8G165WB-BCWE by Samsung Electronics and NT5AD512M16B4-HR by Nanya Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4A8G165WB-BCWE K4A8G165WB-BCWE - 8Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung

K4A8G165WB-BCWE - 8Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung

K4A8G165WB-BCWE ✓ Active
Nanya Technology
NT5AD512M16B4-HR NT5AD512M16B4-HR - 8Gb DDR4 SDRAM 512Mx16 1.2V | Nanya

NT5AD512M16B4-HR - 8Gb DDR4 SDRAM 512Mx16 1.2V | Nanya

NT5AD512M16B4-HR ✓ Active

Specification Comparison

Parameter K4A8G165WB-BCWE NT5AD512M16B4-HR
Brand Samsung Electronics Nanya Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.55 $43.10
Memory Type DDR4 SDRAM DDR4 SDRAM
Density 8 Gb 8Gb
Organization 512M x 16 512M x 16
Data Rate 3200 Mbps 3200 Mbps
Supply Voltage 1.2 V 1.2V
Access Time (CAS Latency) 19 ns —
Interface Parallel —
Package 96FBGA 96-ball TFBGA
Mounting Type Surface Mount —
Operating Temperature 0C to +85C —
Burst Length 8 —
Bank Group Architecture Yes —
On-Die Termination (ODT) Yes, dynamic ODT with ZQ calibration —
Functions Auto precharge, asynchronous reset, CRC, data mask —
RoHS Status Compliant —
Lead Free Yes —
Temperature Range — 0°C to +95°C
Auto Self-Refresh — Yes
Built-in Temperature Sensor — Yes
Auto Precharge — Yes
Asynchronous Reset — Yes
Data Mask — Yes
Write Leveling — Yes
Dynamic On-Chip Termination — Yes
ZQ Calibration — Yes
CRC Function — Yes
RoHS — Compliant

Datasheets & Resources

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