K4A8G165WC-BCTD vs K4A8G165WB-BCTD Comparison
Detailed side-by-side comparison of K4A8G165WC-BCTD by Samsung Electronics and K4A8G165WB-BCTD by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G165WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps x16 | Samsung
K4A8G165WC-BCTD ✓ ActiveSamsung Electronics
K4A8G165WB-BCTD - 8Gb DDR4 SDRAM 512Mx16 2666Mbps | Samsung
K4A8G165WB-BCTD ✓ ActiveSpecification Comparison
| Parameter | K4A8G165WC-BCTD | K4A8G165WB-BCTD |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | DRAM |
| Lifecycle Status | Active | Active |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gb |
| Organization | 512M x16 | 512M x 16 |
| Data Rate | 2666 Mbps (DDR4-2666) | 2666 Mbps |
| Clock Frequency | 1.333 GHz | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| Operating Temperature | 0C to +95C | 0C to +85C |
| Package | 96FBGA | 96FBGA |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Die Generation | C-die (1Y nm-class process) | B-die |
| CRC Function | Yes (write CRC) | — |
| ZQ Calibration | Yes | Supported |
| On-Die Termination | Dynamic ODT | — |
| Data Mask | Yes (x16 DM) | Supported (DM per x16 lane) |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| RoHS Status | Compliant | Compliant (per JLCPCB listing: ROHS) |
| Interface | — | DDR4 (parallel, double data rate) |
| Dynamic On-Die Termination | — | Supported |
| CAS Latency | — | [DATA_NEEDED: CAS Latency] |
| Refresh Rate | — | [DATA_NEEDED: Refresh Rate] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |