K4B4G1646D-BHMA vs H5TC4G63AFR-PBA Comparison
Detailed side-by-side comparison of K4B4G1646D-BHMA by Samsung Electronics and H5TC4G63AFR-PBA by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4B4G1646D-BHMA | H5TC4G63AFR-PBA |
|---|---|---|
| Brand | Samsung Electronics | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Unit Price (USD) | — | $3.98 |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 |
| Data Rate | 1866 Mbps | 1866 Mbps (PC3L-14900) |
| Supply Voltage | 1.35 V (1.283 V to 1.45 V) | — |
| Package | 96-ball FBGA | 96-ball FBGA |
| Operating Temperature | -40°C to +95°C (TC) | — |
| CAS Latency | 13 (at 1866 Mbps) | — |
| Burst Length | 8 and 4 | 8 and 4 (with burst chop) |
| Number of Terminals | 96 | — |
| Lead-Free | Yes | — |
| Halogen Free | Yes | — |
| RoHS Compliant | Yes | — |
| Die Version | D-die | — |
| Refresh Mode | Auto and Self Refresh | — |
| Supply Voltage (VDD/VDDQ) | — | 1.35V |
| Ball Pitch | — | 0.8mm |
| Number of Banks | — | 8 |
| CAS Latency (CL) | — | 11, 12, 13 |
| Operating Temperature Range | — | 0°C to +95°C (Tcase) |
| Interface | — | 16-bit I/O |
| On-Die Termination (ODT) | — | Yes |
| ZQ Calibration | — | Yes |
| Write Leveling | — | Yes |
| Auto Self-Refresh | — | Yes |
| Partial Array Self-Refresh | — | Yes |
| RoHS | — | Compliant |