K4B4G1646D-BHMA vs H5TC4G63AFR-PBA Comparison

Detailed side-by-side comparison of K4B4G1646D-BHMA by Samsung Electronics and H5TC4G63AFR-PBA by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4B4G1646D-BHMA

K4B4G1646D-BHMA - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646D-BHMA βœ“ Active
SK hynix
H5TC4G63AFR-PBA H5TC4G63AFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63AFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63AFR-PBA βœ“ Active

Specification Comparison

Parameter K4B4G1646D-BHMA H5TC4G63AFR-PBA
Brand Samsung Electronics SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2.90 $3.98
Memory Type DDR3L SDRAM DDR3L SDRAM
Density 4 Gb 4Gb
Organization 256M x 16 256M x 16
Data Rate 1866 Mbps 1866 Mbps (PC3L-14900)
Supply Voltage 1.35 V (1.283 V to 1.45 V) β€”
Package 96-ball FBGA 96-ball FBGA
Operating Temperature -40Β°C to +95Β°C (TC) β€”
CAS Latency 13 (at 1866 Mbps) β€”
Burst Length 8 and 4 8 and 4 (with burst chop)
Number of Terminals 96 β€”
Lead-Free Yes β€”
Halogen-Free Yes β€”
RoHS Compliant Yes β€”
Die Version D-die β€”
Refresh Mode Auto and Self Refresh β€”
Supply Voltage (VDD/VDDQ) β€” 1.35V
Ball Pitch β€” 0.8mm
Number of Banks β€” 8
CAS Latency (CL) β€” 11, 12, 13
Operating Temperature Range β€” 0Β°C to +95Β°C (Tcase)
Interface β€” 16-bit I/O
On-Die Termination (ODT) β€” Yes
ZQ Calibration β€” Yes
Write Leveling β€” Yes
Auto Self-Refresh β€” Yes
Partial Array Self-Refresh β€” Yes
RoHS β€” Compliant

Datasheets & Resources

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