H5TC4G63AFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix
MPN: H5TC4G63AFR-PBA β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $5.9 | $5,900.00 |
Drop-in alternatives for H5TC4G63AFR-PBA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
H5TC4G63EFR-PBA
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63AFR-G7A
β Drop-Inβ 99,999 In Stock
$5.9 / Unit
View Datasheet βH5TC4G63AFR-PBI
β Drop-Inβ 99,999 In Stock
$6 / Unit
View Datasheet βMT41K256M16HA-125
β Drop-Inβ 99,999 In Stock
$5.6 / Unit
View Datasheet βH5TC4G83AFR-PBA
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63AFR-PBA Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4Gb |
| Organization | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V |
| Data Rate | 1866 Mbps (PC3L-14900) |
| Package | 96-ball FBGA |
| Number of Banks | 8 |
| Burst Length | 8 (with burst chop 4) |
| CAS Latency | 11, 12, 13 |
| Operating Temperature (Tcase) | 0Β°C to +95Β°C |
| Interface | 16-bit I/O |
| On-Die Termination | Yes |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
| Auto Self-Refresh | Yes |
| RoHS | Compliant |
H5TC4G63AFR-PBA Pin Configuration
| Pin A1 | VDD β Power supply (1.35V) |
| Pin A2 | DQ0 β Data input/output 0 |
| Pin A3 | DQ1 β Data input/output 1 |
| Pin B1 | VSS β Ground |
| Pin B2 | DQ2 β Data input/output 2 |
| Pin B3 | DQ3 β Data input/output 3 |
| Pin C1 | VDDQ β I/O power supply (1.35V) |
| Pin C2 | DQ4 β Data input/output 4 |
| Pin C3 | DQ5 β Data input/output 5 |
| Pin D1 | VSSQ β I/O ground |
| Pin D2 | DQ6 β Data input/output 6 |
| Pin D3 | DQ7 β Data input/output 7 |
| Pin E1 | A0 β Address input 0 |
| Pin E2 | A1 β Address input 1 |
| Pin E3 | A2 β Address input 2 |
| Pin F1 | A3 β Address input 3 |
| Pin F2 | A4 β Address input 4 |
| Pin F3 | A5 β Address input 5 |
| Pin G1 | A6 β Address input 6 |
| Pin G2 | A7 β Address input 7 |
| Pin G3 | A8 β Address input 8 |
| Pin H1 | A9 β Address input 9 |
| Pin H2 | A10/AP β Address input 10 / Auto-precharge |
| Pin H3 | A11 β Address input 11 |
| Pin J1 | A12/BC β Address input 12 / Burst chop |
| Pin J2 | A13 β Address input 13 |
| Pin J3 | A14 β Address input 14 |
| Pin K1 | BA0 β Bank address 0 |
| Pin K2 | BA1 β Bank address 1 |
| Pin K3 | BA2 β Bank address 2 |
| Pin L1 | RAS# β Row address strobe |
| Pin L2 | CAS# β Column address strobe |
| Pin L3 | WE# β Write enable |
| Pin M1 | CS# β Chip select |
| Pin M2 | CKE β Clock enable |
| Pin M3 | ODT β On-die termination |
| Pin N1 | CK β Clock (positive) |
| Pin N2 | CK# β Clock (negative) |
| Pin N3 | RESET# β Reset |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63AFR-PBA is suitable for 6 applications: Laptop Memory, Embedded Systems, Networking Equipment, Industrial PCs, Automotive Infotainment, Set-Top Boxes.
Laptop Memory
The H5TC4G63AFR-PBA is ideal for laptop memory modules due to its low 1.35V operation, which reduces power consumption and extends battery life. Its 4Gb density and 256Mx16 organization provide sufficient capacity for mainstream laptops. The 96-ball FBGA package enables compact module designs, and the 1866 Mbps data rate supports smooth multitasking and multimedia performance.
Recommended
Embedded Systems
In embedded systems, the H5TC4G63AFR-PBA provides high-density memory with low power consumption, making it suitable for industrial controllers, networking equipment, and IoT gateways. Its wide operating temperature range (0Β°C to +95Β°C) ensures reliability in harsh environments. The device's on-die termination and write leveling features improve signal integrity in high-speed designs.
Recommended
Networking Equipment
The H5TC4G63AFR-PBA is well-suited for networking equipment such as routers and switches, where high bandwidth and low latency are critical. Its 1866 Mbps data rate supports fast packet processing, while the 1.35V supply reduces power dissipation in dense line cards. The FBGA package allows for high-density PCB layouts, enabling more memory channels in a limited area.
Recommended
Industrial PCs
For industrial PCs, the H5TC4G63AFR-PBA offers reliable operation over a wide temperature range and robust performance for demanding applications like factory automation and process control. Its low voltage operation reduces heat generation, improving system stability. The 4Gb density provides ample memory for running complex software and data logging.
Recommended
Automotive Infotainment
The H5TC4G63AFR-PBA is used in automotive infotainment systems for navigation, multimedia, and connectivity features. Its low power consumption is beneficial for vehicle electrical systems, and the compact FBGA package fits into space-constrained head units. The device supports high data rates for smooth video playback and responsive user interfaces.
Recommended
Set-Top Boxes
In set-top boxes, the H5TC4G63AFR-PBA provides the memory capacity needed for streaming, DVR, and interactive services. Its low voltage and high density enable compact, energy-efficient designs. The device's fast data rate ensures smooth video decoding and quick channel changes, enhancing the user experience.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63AFR-PBA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63EFR-PBA | H5TC4G63AFR-G7A | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK hynix | SK hynix | SK hynix | Micron |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1600 Mbps | 1866 Mbps |
| Operating Temperature | 0Β°C to +95Β°C | 0Β°C to +95Β°C | 0Β°C to +95Β°C | 0Β°C to +95Β°C |
| CAS Latency | 11, 12, 13 | 11, 12, 13 | 10, 11, 12 | 11, 12, 13 |
Key Differentiators
- Low voltage operation (1.35V) reduces power consumption by ~15% vs standard DDR3 (vs H5TC4G63AFR-G7A)
- Higher data rate (1866 Mbps) for bandwidth-intensive applications (vs H5TC4G63AFR-G7A)
- Pin-compatible with Micron MT41K256M16HA-125 (vs MT41K256M16HA-125)
Design Notes
For high-speed DDR3L routing, maintain controlled impedance of 40-50 ohms for data lines and 50-60 ohms for address/control lines. Keep trace lengths matched within 100 mils for each byte lane. Use ground planes beneath the memory area to minimize noise and ensure signal integrity.
Decouple VDD and VDDQ with 0.1uF and 1uF capacitors placed as close as possible to each power pin. Use a dedicated 1.35V supply with low ripple. The VREF voltage should be generated from a precision divider and bypassed with 0.1uF capacitor to ground.
The H5TC4G63AFR-PBA operates up to 95Β°C Tcase. Ensure adequate airflow or heatsinking in high-ambient environments. The FBGA package has a thermal resistance of approximately 20Β°C/W; calculate junction temperature to avoid exceeding the maximum rating.
Compliance Information
RoHS compliance indicated by SK hynix; other compliance data not explicitly provided.