K4B4G1646D-BYMA0 vs K4B4G1646E-BYMA Comparison
Detailed side-by-side comparison of K4B4G1646D-BYMA0 by Samsung Electronics and K4B4G1646E-BYMA by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4B4G1646D-BYMA0 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
K4B4G1646D-BYMA0 ✓ Active
Specification Comparison
| Parameter | K4B4G1646D-BYMA0 | K4B4G1646E-BYMA |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Unit Price (USD) | — | $14.32 |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM |
| Organization | 256M x 16 | 256M x 16 |
| Total Memory Size | 4 Gb | — |
| Supply Voltage | 1.35 V | 1.35 V (1.28 V to 1.575 V) |
| Data Rate | 1866 Mbps (PC3-14900) | 1866 Mbps/pin |
| Package | 96-ball FBGA | FBGA-96 |
| Operating Temperature Range | 0°C to +85°C | — |
| Lead-Free | Yes | — |
| Halogen Free | Yes | — |
| RoHS Compliant | Yes | — |
| Auto Precharge | Supported | — |
| Asynchronous Reset | Supported | — |
| ZQ Calibration | Supported | — |
| Data Mask | Supported | — |
| Dynamic On-Chip Termination | Supported | — |
| Density | — | 4 Gb |
| Clock Frequency | — | 933 MHz |
| Operating Temperature | — | 0°C to +95°C |
| Operating Current | — | 14 mA |
| Standby Current | — | 2 mA, 3 mA |
| Mounting Type | — | Surface Mount |
| RoHS | — | Compliant |
| CAS Latency | — | [DATA_NEEDED: CAS Latency] |
| Burst Length | — | [DATA_NEEDED: Burst Length] |
| Number of Pins | — | 96 |