K4B4G1646E-BYK0 vs K4B4G1646E-BYK000 Comparison
Detailed side-by-side comparison of K4B4G1646E-BYK0 by Samsung Electronics and K4B4G1646E-BYK000 by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4B4G1646E-BYK0
K4B4G1646E-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
K4B4G1646E-BYK0 β ActiveSamsung Electronics
K4B4G1646E-BYK000
K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
K4B4G1646E-BYK000 β ActiveSpecification Comparison
| Parameter | K4B4G1646E-BYK0 | K4B4G1646E-BYK000 |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1.80 | $0.56 |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gb | β |
| Organization | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35 V (1.283 V to 1.45 V) | β |
| Data Rate | DDR3-1600 (800 MHz) | β |
| Package | 96-ball FBGA (13 x 9 mm, 0.8 mm pitch) | 96-FBGA (BYK) |
| Operating Temperature | 0Β°C to +95Β°C (TC) | [DATA_NEEDED: operating temperature range] |
| CAS Latency | 11 (CL-tRCD-tRP) | β |
| Burst Length | 8 (fixed), 4 (burst chop) | β |
| On-Die Termination | Yes (dynamic ODT) | β |
| ZQ Calibration | Yes | β |
| Auto Precharge | Yes | β |
| Self-Refresh | Yes | β |
| Asynchronous Reset | Yes | β |
| Data Mask | Yes | β |
| RoHS | Compliant | β |
| Memory Size | β | 4 Gbit |
| Speed Grade | β | DDR3-1600 (1.25 ns clock cycle) |
| Clock Frequency | β | 800 MHz |
| CAS Latency (CL) | β | [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data] |
| Supply Voltage (VDD) | β | 1.35 V (DDR3L), 1.5 V compatible (DDR3) |
| Number of Banks | β | [DATA_NEEDED: bank count] |
| Die Process | β | Samsung E-die |
| Mounting Type | β | Surface Mount |
| Interface | β | Parallel |
| Features | β | Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask |
| RoHS Status | β | [DATA_NEEDED: RoHS status] |
| Access Time | β | 1.25 ns |