K4B4G1646E-BYK000 vs MT41K256M16HA-125 Comparison

Detailed side-by-side comparison of K4B4G1646E-BYK000 by Samsung Electronics and MT41K256M16HA-125 by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4B4G1646E-BYK000 K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 ✓ Active
Micron Technology
MT41K256M16HA-125 MT41K256M16HA-125 - 4Gbit DDR3L SDRAM 800MHz | Micron

MT41K256M16HA-125 - 4Gbit DDR3L SDRAM 800MHz | Micron

MT41K256M16HA-125 ✓ Active

Specification Comparison

Parameter K4B4G1646E-BYK000 MT41K256M16HA-125
Brand Samsung Electronics Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.56 $6.36
Memory Type DDR3L SDRAM SDRAM - DDR3L
Memory Size 4 Gbit 4Gbit (256M x 16)
Organization 256M x 16 —
Speed Grade DDR3-1600 (1.25 ns clock cycle) —
Clock Frequency 800 MHz 800 MHz
CAS Latency (CL) [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data] —
Supply Voltage (VDD) 1.35 V (DDR3L), 1.5 V compatible (DDR3) —
Number of Banks [DATA_NEEDED: bank count] —
Die Process Samsung E-die —
Package 96-FBGA (BYK) 96-FBGA (9x14 mm)
Mounting Type Surface Mount Surface Mount
Interface Parallel —
Operating Temperature [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Features Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Access Time 1.25 ns 13.75 ns
Data Bus Width — 16 bit
Supply Voltage — 1.35 V
Number of Pins — 96
Lead-Free — Yes
Logic Family — CMOS
Refresh Interval — 7.8 us at 85C
CAS Latency — 11

Datasheets & Resources

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