K4B4G1646E-BYK000 vs MT41K256M16HA-125 对比

详细并排对比 K4B4G1646E-BYK000 出自 Samsung Electronics 和 MT41K256M16HA-125 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4B4G1646E-BYK000 K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 ✓ 量产中
Micron Technology
MT41K256M16HA-125 MT41K256M16HA-125 - 4Gbit DDR3L SDRAM 800MHz | Micron

MT41K256M16HA-125 - 4Gbit DDR3L SDRAM 800MHz | Micron

MT41K256M16HA-125 ✓ 量产中

规格对比

参数 K4B4G1646E-BYK000 MT41K256M16HA-125
品牌 Samsung Electronics Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.56 $6.36
存储器类型 DDR3L SDRAM SDRAM - DDR3L
存储容量 4 Gbit 4Gbit (256M x 16)
存储组织 256M x 16 —
Speed Grade DDR3-1600 (1.25 ns clock cycle) —
Clock Frequency 800 MHz 800 MHz
CAS Latency (CL) [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data] —
Supply Voltage (VDD) 1.35 V (DDR3L), 1.5 V compatible (DDR3) —
Number of Banks [DATA_NEEDED: bank count] —
Die Process Samsung E-die —
封装 96-FBGA (BYK) 96-FBGA (9x14 mm)
安装类型 Surface Mount Surface Mount
接口 Parallel —
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
特性 Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
Access Time 1.25 ns 13.75 ns
数据总线宽度 — 16 bit
电源电压 — 1.35 V
引脚数 — 96
Lead-Free — Yes
Logic Family — CMOS
Refresh Interval — 7.8 us at 85C
CAS 延迟 — 11

数据手册与资源

浏览全部产品 创建 BOM 获取报价