KMPC8321CVRADDC vs MPC8321CVRADDC Comparison
Detailed side-by-side comparison of KMPC8321CVRADDC by NXP Semiconductors and MPC8321CVRADDC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
KMPC8321CVRADDC - PowerPC e300c2 MPU 266MHz 516-PBGA | NXP
KMPC8321CVRADDC ✓ ActiveNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ ActiveSpecification Comparison
| Parameter | KMPC8321CVRADDC | MPC8321CVRADDC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $62.40 | $20.75 |
| Family | PowerQUICC (MPC83xx) | — |
| Core | PowerPC e300c2 (32-bit, single-core) | PowerPC e300c2 |
| Core Frequency | 266 MHz | — |
| Package | 516-PBGA (27 mm x 27 mm) | — |
| Operating Voltage (Core) | 1.2 V nominal [DATA_NEEDED: exact range] | — |
| Memory Controller | DDR1/DDR2 SDRAM controller with ECC | — |
| L1 Cache | 16 KB instruction / 16 KB data | — |
| PCI Interface | PCI 2.3, 32-bit, up to 66 MHz | — |
| Ethernet | 2x 10/100 Mbps MAC (MII/RMII) | — |
| USB | USB 2.0 Full-Speed (12 Mbps) device/host | — |
| Local Bus | 8/16/32-bit, NAND Flash support | — |
| DMA Channels | 4 | — |
| I2C / UART / SPI | 2x I2C, 2x UART, 1x SPI | — |
| Security Engine | DES / 3DES / AES / SHA / MD5 accelerator | — |
| Operating Temperature | 0°C to +70°C commercial [DATA_NEEDED: confirm industrial grade option] | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| RoHS Status | [DATA_NEEDED: RoHS classification] | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Process Technology | — | 90 nm CMOS |
| Supply Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Operating Temperature Range | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Integrated Peripherals | — | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Encryption / SEC Block | — | Not included (non-E variant) |