KMPC8321CVRADDC vs MPC8321CVRADDC Comparação

Comparação detalhada lado a lado de KMPC8321CVRADDC por NXP Semiconductors e MPC8321CVRADDC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
KMPC8321CVRADDC KMPC8321CVRADDC - PowerPC e300c2 MPU 266MHz 516-PBGA | NXP

KMPC8321CVRADDC - PowerPC e300c2 MPU 266MHz 516-PBGA | NXP

KMPC8321CVRADDC ✓ Ativo
NXP Semiconductors
MPC8321CVRADDC MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP

MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP

MPC8321CVRADDC ✓ Ativo

Comparação de especificações

Parâmetro KMPC8321CVRADDC MPC8321CVRADDC
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $62,40 $20,75
Family PowerQUICC (MPC83xx) —
Core PowerPC e300c2 (32-bit, single-core) PowerPC e300c2
Core Frequency 266 MHz —
Encapsulamento 516-PBGA (27 mm x 27 mm) —
Operating Voltage (Core) 1.2 V nominal [DATA_NEEDED: exact range] —
Memory Controller DDR1/DDR2 SDRAM controller with ECC —
L1 Cache 16 KB instruction / 16 KB data —
PCI Interface PCI 2.3, 32-bit, up to 66 MHz —
Ethernet 2x 10/100 Mbps MAC (MII/RMII) —
USB USB 2.0 Full-Speed (12 Mbps) device/host —
Local Bus 8/16/32-bit, NAND Flash support —
DMA Channels 4 —
I2C / UART / SPI 2x I2C, 2x UART, 1x SPI —
Security Engine DES / 3DES / AES / SHA / MD5 accelerator —
Temperatura de operação 0°C to +70°C commercial [DATA_NEEDED: confirm industrial grade option] —
Tipo de montagem Surface Mount (BGA) Surface Mount
Nível MSL [DATA_NEEDED: MSL rating] —
Status RoHS [DATA_NEEDED: RoHS classification] [DATA_NEEDED: RoHS compliance status]
Manufacturer — NXP Semiconductors (formerly Freescale)
Product Category — Microprocessors (MPU)
Processor Series — MPC8xxx / MPC83xx
Core Architecture — 32-bit Power Architecture
Core Clock Speed — 266 MHz
Number of Cores — 1
Process Technology — 90 nm CMOS
Tensão de alimentação — 1.8 V / 2.5 V / 3.3 V
Package Type — 516-ball TEBGA (Plastic Ball Grid Array)
Package Dimensions — 27 mm x 27 mm
Faixa de temperatura de operação — -40C to +105C
Integrated Memory Controller — DDR1 / DDR2 SDRAM
Integrated Peripherals — QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC
Encryption / SEC Block — Not included (non-E variant)

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