KMPC8321CVRADDC vs MPC8321CVRADDC Сравнение
Подробное сравнение бок о бок KMPC8321CVRADDC от NXP Semiconductors и MPC8321CVRADDC от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
KMPC8321CVRADDC - PowerPC e300c2 MPU 266MHz 516-PBGA | NXP
KMPC8321CVRADDC ✓ АктивенNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ АктивенСравнение характеристик
| Параметр | KMPC8321CVRADDC | MPC8321CVRADDC |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $62,40 | $20,75 |
| Family | PowerQUICC (MPC83xx) | — |
| Core | PowerPC e300c2 (32-bit, single-core) | PowerPC e300c2 |
| Core Frequency | 266 MHz | — |
| Корпус | 516-PBGA (27 mm x 27 mm) | — |
| Operating Voltage (Core) | 1.2 V nominal [DATA_NEEDED: exact range] | — |
| Memory Controller | DDR1/DDR2 SDRAM controller with ECC | — |
| L1 Cache | 16 KB instruction / 16 KB data | — |
| PCI Interface | PCI 2.3, 32-bit, up to 66 MHz | — |
| Ethernet | 2x 10/100 Mbps MAC (MII/RMII) | — |
| USB | USB 2.0 Full-Speed (12 Mbps) device/host | — |
| Local Bus | 8/16/32-bit, NAND Flash support | — |
| DMA Channels | 4 | — |
| I2C / UART / SPI | 2x I2C, 2x UART, 1x SPI | — |
| Security Engine | DES / 3DES / AES / SHA / MD5 accelerator | — |
| Рабочая температура | 0°C to +70°C commercial [DATA_NEEDED: confirm industrial grade option] | — |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Уровень MSL | [DATA_NEEDED: MSL rating] | — |
| Статус RoHS | [DATA_NEEDED: RoHS classification] | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Process Technology | — | 90 nm CMOS |
| Напряжение питания | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Диапазон рабочих температур | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Integrated Peripherals | — | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Encryption / SEC Block | — | Not included (non-E variant) |