LFE5UM-85F-6BG554C vs LFE5UM-45F-6BG554C Comparison
Detailed side-by-side comparison of LFE5UM-85F-6BG554C by Lattice Semiconductor and LFE5UM-45F-6BG554C by Lattice Semiconductor. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Lattice Semiconductor
LFE5UM-85F-6BG554C - ECP5-5G FPGA, 84K LUTs, 12 SERDES | Lattice
LFE5UM-85F-6BG554C ✓ ActiveLattice Semiconductor
LFE5UM-45F-6BG554C - ECP5 FPGA 45K LUTs w/ SERDES, 554-CABGA | Lattice
LFE5UM-45F-6BG554C ✓ ActiveSpecification Comparison
| Parameter | LFE5UM-85F-6BG554C | LFE5UM-45F-6BG554C |
|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $13.10 | $115.10 |
| Family | ECP5-5G (LFE5UM) | LatticeECP5 |
| Logic Elements (LUT4) | 84000 | — |
| Embedded Block RAM | 3744 Kbits | 1,944 Kb |
| Distributed RAM | [DATA_NEEDED: distributed RAM Kbits] | [DATA_NEEDED: distributed RAM Kbits] |
| DSP Slices (18x18 multipliers) | 156 | — |
| User I/O | 259 | — |
| SERDES Channels | 12 | 4 x multi-protocol SERDES (1.5 / 3.2 / 5 Gbps) |
| SERDES Data Rate (max) | 5 Gbps | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Node | 40 nm | 40 nm CMOS |
| Speed Grade | -6 | -6 (commercial, lower timing margin than -7/-8) |
| Package | 554-ball caBGA (BG554) | 554-pin cabga (chip-array BGA), 23 mm x 23 mm |
| Package Body Size | 23 x 23 mm | — |
| Operating Temperature Grade | Commercial (C) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL rating] | 3 (per partstack data) |
| RoHS Status | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external boot) | — |
| Logic Cells | — | 44,000 (nominal, LUT4-equivalent) |
| Logic Elements / LUTs | — | Approximately 45,000 LUT4 |
| DSP Slices | — | [DATA_NEEDED: DSP slice count] |
| User I/O (this package) | — | 245 |
| Hardened PCIe Gen2 | — | Yes (x1 endpoint) |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Operating Temperature | — | Commercial (0C to +85C, C suffix) |
| Peak Reflow Temperature | — | 260 C, 30 s max |
| Lead-Free / Termination Finish | — | Yes, Tin-Silver-Copper (e1 per JESD-609) |
| Configuration Interface | — | IEEE 1149.1 JTAG, SPI, Dual-boot / Multi-boot |
| TransFR Support | — | Yes (transparent field reconfiguration) |