LFE5UM-85F-6BG554C vs LFE5UM-45F-6BG554C 비교
다음의 상세 나란히 비교: LFE5UM-85F-6BG554C 제조: Lattice Semiconductor 및 LFE5UM-45F-6BG554C 제조: Lattice Semiconductor. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Lattice Semiconductor
LFE5UM-85F-6BG554C - ECP5-5G FPGA, 84K LUTs, 12 SERDES | Lattice
LFE5UM-85F-6BG554C ✓ 활성Lattice Semiconductor
LFE5UM-45F-6BG554C - ECP5 FPGA 45K LUTs w/ SERDES, 554-CABGA | Lattice
LFE5UM-45F-6BG554C ✓ 활성사양 비교
| 파라미터 | LFE5UM-85F-6BG554C | LFE5UM-45F-6BG554C |
|---|---|---|
| 브랜드 | Lattice Semiconductor | Lattice Semiconductor |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $13.10 | $115.10 |
| Family | ECP5-5G (LFE5UM) | LatticeECP5 |
| Logic Elements (LUT4) | 84000 | — |
| Embedded Block RAM | 3744 Kbits | 1,944 Kb |
| Distributed RAM | [DATA_NEEDED: distributed RAM Kbits] | [DATA_NEEDED: distributed RAM Kbits] |
| DSP Slices (18x18 multipliers) | 156 | — |
| User I/O | 259 | — |
| SERDES Channels | 12 | 4 x multi-protocol SERDES (1.5 / 3.2 / 5 Gbps) |
| SERDES Data Rate (max) | 5 Gbps | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Node | 40 nm | 40 nm CMOS |
| Speed Grade | -6 | -6 (commercial, lower timing margin than -7/-8) |
| 패키지 | 554-ball caBGA (BG554) | 554-pin cabga (chip-array BGA), 23 mm x 23 mm |
| Package Body Size | 23 x 23 mm | — |
| Operating Temperature Grade | Commercial (C) | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 레벨 | [DATA_NEEDED: MSL rating] | 3 (per partstack data) |
| RoHS 상태 | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external boot) | — |
| Logic Cells | — | 44,000 (nominal, LUT4-equivalent) |
| Logic Elements / LUTs | — | Approximately 45,000 LUT4 |
| DSP Slices | — | [DATA_NEEDED: DSP slice count] |
| User I/O (this package) | — | 245 |
| Hardened PCIe Gen2 | — | Yes (x1 endpoint) |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| 동작 온도 | — | Commercial (0C to +85C, C suffix) |
| Peak Reflow Temperature | — | 260 C, 30 s max |
| Lead-Free / Termination Finish | — | Yes, Tin-Silver-Copper (e1 per JESD-609) |
| Configuration Interface | — | IEEE 1149.1 JTAG, SPI, Dual-boot / Multi-boot |
| TransFR Support | — | Yes (transparent field reconfiguration) |