LFE5UM-85F-6BG554C vs LFE5UM-45F-6BG554C Comparaison
Comparaison détaillée côte à côte de LFE5UM-85F-6BG554C par Lattice Semiconductor et LFE5UM-45F-6BG554C par Lattice Semiconductor. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Lattice Semiconductor
LFE5UM-85F-6BG554C - ECP5-5G FPGA, 84K LUTs, 12 SERDES | Lattice
LFE5UM-85F-6BG554C ✓ ActifLattice Semiconductor
LFE5UM-45F-6BG554C - ECP5 FPGA 45K LUTs w/ SERDES, 554-CABGA | Lattice
LFE5UM-45F-6BG554C ✓ ActifComparaison des spécifications
| Paramètre | LFE5UM-85F-6BG554C | LFE5UM-45F-6BG554C |
|---|---|---|
| Marque | Lattice Semiconductor | Lattice Semiconductor |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $13,10 | $115,10 |
| Family | ECP5-5G (LFE5UM) | LatticeECP5 |
| Logic Elements (LUT4) | 84000 | — |
| Embedded Block RAM | 3744 Kbits | 1,944 Kb |
| Distributed RAM | [DATA_NEEDED: distributed RAM Kbits] | [DATA_NEEDED: distributed RAM Kbits] |
| DSP Slices (18x18 multipliers) | 156 | — |
| User I/O | 259 | — |
| SERDES Channels | 12 | 4 x multi-protocol SERDES (1.5 / 3.2 / 5 Gbps) |
| SERDES Data Rate (max) | 5 Gbps | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Node | 40 nm | 40 nm CMOS |
| Speed Grade | -6 | -6 (commercial, lower timing margin than -7/-8) |
| Boîtier | 554-ball caBGA (BG554) | 554-pin cabga (chip-array BGA), 23 mm x 23 mm |
| Package Body Size | 23 x 23 mm | — |
| Operating Temperature Grade | Commercial (C) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Niveau MSL | [DATA_NEEDED: MSL rating] | 3 (per partstack data) |
| Statut RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external boot) | — |
| Logic Cells | — | 44,000 (nominal, LUT4-equivalent) |
| Logic Elements / LUTs | — | Approximately 45,000 LUT4 |
| DSP Slices | — | [DATA_NEEDED: DSP slice count] |
| User I/O (this package) | — | 245 |
| Hardened PCIe Gen2 | — | Yes (x1 endpoint) |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Température de fonctionnement | — | Commercial (0C to +85C, C suffix) |
| Peak Reflow Temperature | — | 260 C, 30 s max |
| Lead-Free / Termination Finish | — | Yes, Tin-Silver-Copper (e1 per JESD-609) |
| Configuration Interface | — | IEEE 1149.1 JTAG, SPI, Dual-boot / Multi-boot |
| TransFR Support | — | Yes (transparent field reconfiguration) |