LPC5526JBD64E vs LPC55S28JBD64E Comparison
Detailed side-by-side comparison of LPC5526JBD64E by NXP Semiconductors and LPC55S28JBD64E by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | LPC5526JBD64E | LPC55S28JBD64E |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.95 | $3.44 |
| Core Processor | ARM Cortex-M33 (r0p3) | Arm Cortex-M33 |
| Core Size | 32-Bit | 32-Bit |
| Maximum Clock Frequency | 150 MHz | 150 MHz |
| Flash Memory | 256KB (256K x 8) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| Security Feature | ARM TrustZone | — |
| Memory Protection Unit | Yes (MPU) | Yes (MPU) |
| Interrupt Controller | NVIC (built-in) | NVIC with NMI input (selectable sources) |
| NMI Input | Yes, with selection of sources | — |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Supply Voltage | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Operating Temperature | [DATA_NEEDED: temperature range] | [DATA_NEEDED: operating temperature range] |
| Package | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 | 3 |
| Peak Reflow Temperature | 260 C | 260 C |
| Max Time At Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| RoHS Status | Compliant | Compliant (e3 lead-free finish) |
| Lifecycle Status | Active | — |
| Flash Memory Size | — | 512 KB (512K x 8) |
| SRAM Size | — | 128 KB |
| Series | — | LPC55S2x |
| Security Features | — | TrustZone, PUF-based security (S-series) |
| Maximum Time at Peak Reflow | — | 30 s |