LPC5526JBD64E vs LPC55S28JBD64E 对比
详细并排对比 LPC5526JBD64E 出自 NXP Semiconductors 和 LPC55S28JBD64E 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | LPC5526JBD64E | LPC55S28JBD64E |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2.95 | $3.44 |
| Core Processor | ARM Cortex-M33 (r0p3) | Arm Cortex-M33 |
| Core Size | 32-Bit | 32-Bit |
| 最大时钟频率 | 150 MHz | 150 MHz |
| Flash Memory | 256KB (256K x 8) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| Security Feature | ARM TrustZone | — |
| Memory Protection Unit | Yes (MPU) | Yes (MPU) |
| Interrupt Controller | NVIC (built-in) | NVIC with NMI input (selectable sources) |
| NMI Input | Yes, with selection of sources | — |
| Process Technology | 40 nm NVM | 40 nm NVM |
| 电源电压 | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| 工作温度 | [DATA_NEEDED: temperature range] | [DATA_NEEDED: operating temperature range] |
| 封装 | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| 湿敏等级（MSL） | 3 | 3 |
| Peak Reflow Temperature | 260 C | 260 C |
| Max Time At Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| RoHS 状态 | Compliant | Compliant (e3 lead-free finish) |
| 生命周期状态 | Active | — |
| Flash Memory Size | — | 512 KB (512K x 8) |
| SRAM Size | — | 128 KB |
| Series | — | LPC55S2x |
| Security Features | — | TrustZone, PUF-based security (S-series) |
| Maximum Time at Peak Reflow | — | 30 s |