LPC5526JBD64E vs LPC55S28JBD64E Vergleich
Detaillierter Direktvergleich von LPC5526JBD64E von NXP Semiconductors und LPC55S28JBD64E von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | LPC5526JBD64E | LPC55S28JBD64E |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,95 | $3,44 |
| Core Processor | ARM Cortex-M33 (r0p3) | Arm Cortex-M33 |
| Core Size | 32-Bit | 32-Bit |
| Maximale Taktfrequenz | 150 MHz | 150 MHz |
| Flash Memory | 256KB (256K x 8) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| Security Feature | ARM TrustZone | — |
| Memory Protection Unit | Yes (MPU) | Yes (MPU) |
| Interrupt Controller | NVIC (built-in) | NVIC with NMI input (selectable sources) |
| NMI Input | Yes, with selection of sources | — |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Betriebstemperatur | [DATA_NEEDED: temperature range] | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) |
| Montageart | Surface Mount | Surface Mount |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 | 3 |
| Peak Reflow Temperature | 260 C | 260 C |
| Max Time At Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| RoHS-Status | Compliant | Compliant (e3 lead-free finish) |
| Lebenszyklusstatus | Active | — |
| Flash Memory Size | — | 512 KB (512K x 8) |
| SRAM Size | — | 128 KB |
| Series | — | LPC55S2x |
| Security Features | — | TrustZone, PUF-based security (S-series) |
| Maximum Time at Peak Reflow | — | 30 s |