LPC55S28JBD64E vs LPC5526JBD64E Comparison
Detailed side-by-side comparison of LPC55S28JBD64E by NXP Semiconductors and LPC5526JBD64E by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | LPC55S28JBD64E | LPC5526JBD64E |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.44 | $2.95 |
| Core Processor | Arm Cortex-M33 | ARM Cortex-M33 (r0p3) |
| Core Size | 32-Bit | 32-Bit |
| Maximum Clock Frequency | 150 MHz | 150 MHz |
| Flash Memory Size | 512 KB (512K x 8) | — |
| SRAM Size | 128 KB | — |
| Series | LPC55S2x | — |
| Package | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Security Features | TrustZone, PUF-based security (S-series) | — |
| Memory Protection Unit | Yes (MPU) | Yes (MPU) |
| Interrupt Controller | NVIC with NMI input (selectable sources) | NVIC (built-in) |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: temperature range] |
| Supply Voltage | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Moisture Sensitivity Level (MSL) | 3 | 3 |
| Peak Reflow Temperature | 260 C | 260 C |
| Maximum Time at Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| RoHS Status | Compliant (e3 lead-free finish) | Compliant |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Flash Memory | — | 256KB (256K x 8) |
| RAM Size | — | [DATA_NEEDED: SRAM size] |
| Security Feature | — | ARM TrustZone |
| NMI Input | — | Yes, with selection of sources |
| Max Time At Peak Reflow | — | 30 s |
| Lifecycle Status | — | Active |