M1AFS1500-1FGG256I vs M1AFS1500-1FGG256 Comparison

Detailed side-by-side comparison of M1AFS1500-1FGG256I by Microchip Technology and M1AFS1500-1FGG256 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M1AFS1500-1FGG256I M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256I ✓ Active
Microchip Technology
M1AFS1500-1FGG256 M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip

M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip

M1AFS1500-1FGG256 ✓ Active

Specification Comparison

Parameter M1AFS1500-1FGG256I M1AFS1500-1FGG256
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $136.90 $172.23
Family Fusion (M1 series, mixed-signal FPGA) —
System Gates 1.5 million 1,500,000
Processor Core ARM Cortex-M1 (soft core in fabric) —
User I/O 119 —
Flash Configuration Memory 276480 bits —
Logic Cells 38400 38,400
Core Supply Voltage 1.5 V —
Process Technology 130 nm flash-based —
Package 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch —
Operating Temperature -40C to +85C (industrial, I suffix) —
Speed Grade -1 (standard) -1
Configuration Type Flash-based, instant-on, single chip —
Security 128-bit flash lock, AES decryption —
Analog Features Configurable analog blocks (mixed-signal) —
Clock Management Integrated CCC (clock conditioning circuits) Integrated clock generation and management circuitry
Mounting Type Surface Mount —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Series — Fusion (M1AFS1500)
Embedded Processor — ARM Cortex-M1
Maximum Clock Frequency — 350 MHz
Number of I/Os — 119
Supply Voltage — 1.5 V
Technology — CMOS, 130 nm
Configuration Memory — Flash-based (non-volatile)
Package / Case — 256-LBGA (FBGA, S-PBGA-B256)
Ball Pitch — 1.00 mm
Mounting Style — SMD/SMT
Minimum Operating Temperature — 0 C
Maximum Operating Temperature — +70 C
Packaging — Tray
Integrated Analog Blocks — Yes (configurable analog conditioning and conversion)
Integrated Flash Memory Blocks — Yes

Datasheets & Resources

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