M1AFS1500-1FGG256I vs M1AFS1500-1FGG256 Vergleich
Detaillierter Direktvergleich von M1AFS1500-1FGG256I von Microchip Technology und M1AFS1500-1FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256I ✓ AktivMicrochip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-1FGG256I | M1AFS1500-1FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $136,90 | $172,23 |
| Family | Fusion (M1 series, mixed-signal FPGA) | — |
| System Gates | 1.5 million | 1,500,000 |
| Processor Core | ARM Cortex-M1 (soft core in fabric) | — |
| User I/O | 119 | — |
| Flash Configuration Memory | 276480 bits | — |
| Logic Cells | 38400 | 38,400 |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | — |
| Gehäuse | 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch | — |
| Betriebstemperatur | -40C to +85C (industrial, I suffix) | — |
| Speed Grade | -1 (standard) | -1 |
| Configuration Type | Flash-based, instant-on, single chip | — |
| Security | 128-bit flash lock, AES decryption | — |
| Analog Features | Configurable analog blocks (mixed-signal) | — |
| Clock Management | Integrated CCC (clock conditioning circuits) | Integrated clock generation and management circuitry |
| Montageart | Surface Mount | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Series | — | Fusion (M1AFS1500) |
| Embedded Processor | — | ARM Cortex-M1 |
| Maximale Taktfrequenz | — | 350 MHz |
| Number of I/Os | — | 119 |
| Versorgungsspannung | — | 1.5 V |
| Technology | — | CMOS, 130 nm |
| Configuration Memory | — | Flash-based (non-volatile) |
| Gehäuse / Bauform | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Montagestil | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Packaging | — | Tray |
| Integrated Analog Blocks | — | Yes (configurable analog conditioning and conversion) |
| Integrated Flash Memory Blocks | — | Yes |