M7AFS600-1FGG256 vs M7AFS600-1FGG256I Comparison

Detailed side-by-side comparison of M7AFS600-1FGG256 by Microchip Technology and M7AFS600-1FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M7AFS600-1FGG256 M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-1FGG256 Nrnd
Microchip Technology
M7AFS600-1FGG256I M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I ✓ Active

Specification Comparison

Parameter M7AFS600-1FGG256 M7AFS600-1FGG256I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $92.00 $0.00
Family Fusion (Mixed-Signal FPGA) Fusion (Mixed-Signal Flash FPGA)
System Gates 600K 600K
Fabric Elements (Registers) 110592 —
Embedded Processor 32-bit ARM CoreMP7 (hard core) —
Speed Grade -1 -1
Process Technology 130 nm flash 130 nm, 7-layer metal flash-based CMOS
Core Supply Voltage 1.5 V —
Package 256-LBGA (FPBGA-256, 17x17 mm) —
Mounting Type Surface Mount —
Configuration Flash-based, nonvolatile, live at power-up —
Operating Temperature 0C to +70C (commercial) —
Maximum Frequency [DATA_NEEDED: maximum fabric/system frequency] —
Number of I/O [DATA_NEEDED: user I/O count for FGG256] 119
Analog Peripherals [DATA_NEEDED: ADC channel count and resolution] —
On-chip RTC / POR [DATA_NEEDED: RTC/POR availability details] —
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
MSL Level [DATA_NEEDED: moisture sensitivity level] —
Processor Core — ARM CoreMP7
Operating Supply Voltage — 1.5 V
Configuration Memory — Flash (nonvolatile)
System Performance — Up to 350 MHz
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Package / Case — 256-Ball FBGA (FGG256)
Mounting Style — SMD/SMT
Packaging — Tray
Series — M7AFS600
Live at Power-Up (LAPU) — Yes
Analog Subsystem — Integrated ADC, voltage/temperature monitors (per Fusion family datasheet)

Datasheets & Resources

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